Senior Photonics Process Engineer, Hybrid Integration - US

HyperLight•Cambridge, MA

About The Position

HyperLight is at the forefront of the commercialization of thin-film lithium niobate (TFLN) integrated photonics - a material and process technology that is enabling high-performance, scalable optical components across AI/datacom infrastructure, hyperscale computing, quantum computing, sensing, and beyond. Founded in 2018 and backed by leading venture capital, we’ve built a team and a platform focused on real-world mass deployment of TFLN photonics technology. At the core of our work is the TFLN Chiplet™ platform — a modular, integrated architecture designed for scalability, manufacturability, and seamless integration into complex systems. It offers a rare combination of extraordinary performance and industrial readiness, enabling system developers across applications to deploy the technology fast and ready. We partner with our customers and suppliers from conceptualization, design, and prototyping phases, all the way through mass production to ensure smooth and rapid deployment of TFLN photonic technology. We believe our platform is the key, in the golden age of integrated photonics, to empower humanity to the next level. We assembled a world class team covering engineering, business, and operations. We believe in the power of integrity, innovation, collaboration, and pragmatic solutions. Our diverse team thrives on challenges and is united by a shared commitment to excellence. We take pride in tackling complex challenges with curiosity, humility, and a deep sense of care for one another. If you are interested in pushing the limits of integrated photonics devices and revolutionizing their applications through hardware innovation, we are looking for you to join HyperLight’s growing team as a Senior Photonics Process Engineer . We are seeking highly motivated individuals who enjoy problem solving and will thrive in a collaborative environment. Join us to make a real-world impact in a fast-paced, collaborative, and high-growth environment!

Requirements

PhD in Electrical Engineering, Applied Physics, Materials Science, Physics, or related fields.
5+ years of experience in integrated photonics, semiconductors, or microelectronics fabrication.
Expertise in silicon photonics.
Experience with TFLN.
Expertise with advanced packaging (3D, 2.5D) technologies.
Track record in developing and optimizing new nanofabrication processes.
Strong problem-solving skills and ability to analyze complex data sets.
Strong communications skills with Fluency in both English and Mandarin is a must

Nice To Haves

Experience with RF/high-speed electronics is a plus

Responsibilities

Explore, define, and optimize next-generation fabrication processes for a high performance standalone TFLN PIC platform, including hybrid integration of TFLN to silicon photonics platforms, using advanced packaging technologies.
Passive and active component design for hybrid TFLN SiPh platform.
Conduct root cause analysis and implement solutions to achieve high yield targets.
Collaborate with cross-functional teams, including Design, Test Engineering, and Production, to drive process optimization initiatives.
Prepare and maintain documentation, including process specifications, standard operating procedures, and reports.
Support the transfer and qualification of new products or processes into the manufacturing environment.

Benefits

Competitive market-based compensation
Comprehensive health coverage, including medical, vision, and dental plans for individuals and families
401(k) retirement plans with employee matching
Paid Parental Leave
Life and disability insurance
Commuter benefits and subsidies
Professional growth and mentorship opportunities

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