Senior Packaging Thermal Architect

Intel•Chandler, AZ

2d•Onsite

About The Position

Role Overview: The Senior Thermal Architect will lead thermal design and strategy for next-generation GPU, AI accelerators, and data center products. This role is critical to enabling high-performance computing at scale while meeting stringent thermal requirements. You will define thermal architecture across silicon, package, and platform levels, ensuring optimal thermal performance for products approaching multi-kilowatt levels: Key Responsibilities: Thermal Architecture Leadership Define and deliver advanced packaging thermal solutions for advanced GPU/AI products Architect thermal strategies for 3DIC and advanced packaging technologies, including chiplets and heterogeneous integration. Design and Analysis Develop analytical and experimental methods for thermal characterization and prediction. Drive co-optimization of thermal, electrical, and mechanical design across silicon, package, and system levels. Innovation and Technology Development Push the boundaries of thermal management to support Moore's Law progression. Evaluate and integrate emerging cooling technologies (e.g., liquid cooling, immersion cooling) for data center sustainability. Cross-Functional Collaboration Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance. Engage with external customers and ecosystem partners to align thermal solutions with product requirements. Qualifications: You must possess the below minimum qualifications to be initially considered for this position. Preferred qualifications are in addition to the minimum requirements and are considered a plus factor in identifying top candidates. Knowledge and/or experience listed below would be obtained through a combination of your school, work and/or classes and/or research and/or relevant previous job and/or internship experiences .

Requirements

MS or PhD in Mechanical Engineering, Thermal Sciences, or related field.
10+ years in thermal design of semiconductor products
Proven track record in thermal architecture and advanced packaging.
Proficient in thermal simulation tools (e.g., CFD, FEA) and experimental validation.

Nice To Haves

10 + years experience in high-performance computing or data center products.
Proven track record in GPU/AI thermal architecture and advanced packaging.
Experience with rack-scale cooling solutions and liquid cooling technologies.
Familiarity with AI/GPU performance trends and their thermal implications.
Strong understanding of power delivery, energy efficiency, and cooling technologies.
Ability to influence architecture decisions and drive innovation across global teams.

Responsibilities

Define and deliver advanced packaging thermal solutions for advanced GPU/AI products
Architect thermal strategies for 3DIC and advanced packaging technologies, including chiplets and heterogeneous integration.
Develop analytical and experimental methods for thermal characterization and prediction.
Drive co-optimization of thermal, electrical, and mechanical design across silicon, package, and system levels.
Push the boundaries of thermal management to support Moore's Law progression.
Evaluate and integrate emerging cooling technologies (e.g., liquid cooling, immersion cooling) for data center sustainability.
Partner with silicon design, packaging, and platform teams to ensure thermal compliance and performance.
Engage with external customers and ecosystem partners to align thermal solutions with product requirements.

Benefits

We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock, bonuses, as well as, benefit programs which include health, retirement, and vacation.
Find more information about all of our Amazing Benefits here: https://intel.wd1.myworkdayjobs.com/External/page/1025c144664a100150b4b1665c750003

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