Senior Package Modeling Engineer

NVIDIA•Us, CA

1d•Hybrid

About The Position

Join us in an outstanding opportunity as a Senior Package Modeling Engineer in the Advanced Technology Group (ATG) at NVIDIA. Using our history of innovation, you will contribute to the next era of computing, driven by AI and pioneering technology. As part of our team, your efforts will directly affect the reliability and performance of advanced semiconductor package developments. This role is ideal for someone who is highly motivated and committed to achieving flawless results in a cooperative environment.

Requirements

MS or PhD or equivalent experience in Mechanical Engineering, Materials Science, or related field.
5+ years of FEA modeling/simulation experience.
Strong expertise in FEA tools (ANSYS, Abaqus, COMSOL, or equivalent).
Knowledge of thermal-mechanical interactions and reliability failure modes.
Familiarity with JEDEC reliability standards and accelerated life testing.
Practical understanding of advanced semiconductor packaging architecture and materials (flip-chip, 2.5D/3D IC, CoWoS-R, CoWoS-L, advanced substrates).
Excellent problem-solving, analytical, and communication skills.

Responsibilities

Conduct Finite Element Analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior throughout advanced semiconductor packaging platforms.
Contribute to packaging technology direction and long‑term roadmaps by evaluating new materials, interconnect concepts, and process options with a focus on structural robustness and reliability.
Analyze material properties and their impact on package reliability.
Establish modeling approaches and assumptions, interpret simulation results, and provide practical mentorship that influences package build, material selection, and manufacturing processes.
Collaborate with cross-functional teams to ensure robust package builds.
Document modeling methodologies and present findings to collaborators.