Senior Package Layout Engineer

ARMChandler, AZ
79d$191,100 - $258,500Hybrid

About The Position

Arm has a great opportunity for a Senior Package Layout Engineer in our System-in-Package team! This Engineer will be part of a team responsible for implementing ARM's next generation of SoC's in the IoT, Automotive, and Compute spaces. These complex designs use current and emerging 2.5 and 3D technologies and will require you to work closely with IP, PCB, SI/PI and Systems teams in France, US, UK, and other ARM locations as needed as well as our technology partners.

Requirements

  • An Electrical Engineering degree or equivalent.
  • Experience with 2.5D and 3D package systems and their SI/PI requirements.
  • 7+ years of recent experience in the use of Cadence APD & Allegro toolsets.
  • Facilitate standardization by being aware of the bigger picture, including design features which will drive standardization and improve efficiency throughout the department.

Nice To Haves

  • Familiarity with EDA vendor collaboration, tool evaluation, and issue resolution.
  • Strong verbal, written communication and presentation skills.
  • Programming experience in Python, SKILL, or TCL.
  • Able to optimize design methodologies in packaging design.

Responsibilities

  • Assist in the definition, design, and verification of our package designs.
  • Adapt quickly to loosely defined problems and adapt to changes.
  • Create layouts using best-known practices for DFM, DFA, Signal and Power Delivery Networks.
  • Work with minimal supervision and approach challenges with enthusiasm and persistence.
  • Bring forward ideas to improve overall team efficiency.
  • Communicate and coordinate with external vendors as necessary.

Benefits

  • Salary Range: $191,100-$258,500 per year.
  • Reasonable accommodation for individuals with disabilities during the job application and interview process.
  • Hybrid working environment that supports high performance and personal wellbeing.
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