Senior Package Design Engineer

Rambus • San Jose, CA

15h • Hybrid

About The Position

Rambus, a premier chip and silicon IP provider making data faster and safer, is seeking to hire an exceptional Senior Package Design Engineer to join our Package Engineering team in San Jose, CA. In this role, you will be working with some of the brightest inventors and engineers in the world developing products that make data faster and safer. This is a full-time position reporting to the Director of Package Engineering. As a Senior Package Design Engineer, you will be responsible for supporting the design and layout of new products from early concept to tape out, focusing primarily on several elements that enable high-yielding, low defectivity production. The Senior Package Design Engineer will have the opportunity to work with multiple package technologies and outsourced suppliers to ensure manufacturing readiness for the Rambus product portfolio. Rambus offers a flexible work environment, embracing a hybrid approach for most office-based roles. Employees are encouraged to spend an average of at least three days per week onsite, allowing for two days of remote work.

Requirements

• MS Degree in EE/CE
• Proficiency with Cadence Allegro Package Designer (APD) and AutoCAD.
• 5+ years of experience in packaging design and layout, preferably in an advanced silicon node.
• Proven track record with multiple packaging types where products have gone to volume production.
• Experience routing high-speed, high pin count devices and understanding of signal and power integrity fundamentals.
• Knowledge of organic laminate substrate technologies and manufacturing capabilities.
• Awareness of JEDEC standards and other specifications that may govern package design.
• Understanding of package material properties related to high-volume production and reliability: temperature cycling, HAST, shock, vibration, thermal resistance, outgassing, etc.
• Excellent communication, initiative, multi-tasking, and time management.
• Strong commitment and ability to work in cross functional and globally dispersed teams

Responsibilities

• Drive early chip-package co-design and development of bump and ball map.
• Own layout of package types such as FCCSP, FCBGA, FCQFN, WLCSP, QFN.
• Collaborate with multiple cross-functional teams (Chip Design, SI/PI, Packaging)
• Analyze cost/performance/reliability trade-offs to complete layout of new products and test chips.
• Interact with OSAT partners and substrate/leadframe suppliers for design reviews and execution.
• Continuous improvement of package design workflow and unified package design guidelines.
• Assist with model creation for thermo-mechanical package simulations.

Benefits

• Rambus offers a competitive compensation package including base salary, bonus, equity, matching 401(k), employee stock purchase plan, comprehensive medical and dental benefits, time-off program, and gym membership.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior