Senior or Principal Signal Power Integrity and Multiphysics Engineer, Texas Institute for Electronics

The University of Texas at Austin•Austin, TX

12d•Hybrid

About The Position

This role is to lead and execute comprehensive Signal Integrity (SI), Power Integrity (PI), and Multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages. The position will also collaborate with EDA vendors, OSATs, and foundries, and stay current with next-gen interface standards to guide technical strategy and mentor junior engineers.

Requirements

Senior Engineer: BS in Electrical Engineering, Computer Engineering, Applied Physics, or related discipline. 8 or more years of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
Principal Engineer: 12 or more years of direct, hands-on experience in signal integrity, power integrity, and multiphysics simulations for advanced packaging, 2.5D/3DIC, or heterogeneous integration platforms.
For both titles: Strong expertise with EDA/EM/multiphysics tools: Ansys HFSS/SIwave, Cadence Sigrity/Clarity, Synopsys RaptorX, Siemens HyperLynx, Keysight ADS, COMSOL, CST Studio.
Proven ability to extract/package-level models (RLC, S-parameters, dielectric/thermal constants, warpage/stress data) and integrate them into design enablement flows.
Demonstrated experience creating and validating PDK/ADK simulation collateral spanning SI/PI, RF, thermal, and mechanical domains.
Hands-on scripting/automation skills (Python, Tcl, SKILL, etc.) to streamline simulation flows.
Startup DNA. You’re energized by ambiguity, act with urgency, and take personal ownership for outcomes. You make things happen.
Execution mindset. You have demonstrated experience working in a hands-on role driving progress across multiple initiatives without layers of management.
Location. Austin, Texas is preferred for close collaboration with our engineering teams and partners. Hybrid work arrangements may be possible with travel up to 30–50%. Such arrangements are subject to University review and approval in relation to jurisdictional employment-related laws, rules, and regulations.

Nice To Haves

MS or PhD in Electrical Engineering, Applied Physics, or related discipline.
Deep experience with multi-material packages (Si, glass, organics, Cu, RDL, TSV, hybrid bonding, etc.).
Expertise in system-level co-simulation spanning electrical, thermal, and mechanical domains for high-power/high-bandwidth-density packages.
Familiarity with industry standards (IEEE, JEDEC, OIF, UCIe, 3Dblox, JEP30) and experience contributing to working groups.
Background in high-speed interconnect modeling and compliance testing for PCIe, CXL, UCIe, SerDes, HBM, or similar standards.
Track record of technical publications, patents, or open-source contributions in SI/PI/multiphysics simulation and design enablement.

Responsibilities

Own and execute hands-on SI/PI and Multiphysics simulations for advanced 2.5D/3.0D heterogeneous integration and multi-material packages.
Perform modeling, extraction, and verification of high-speed interconnects, power delivery networks, thermal management, and mechanical stress across chiplets and advanced substrates.
Build and validate comprehensive ADK/PDK models (electrical, EM, thermal, mechanical) that accurately represent package-level behavior and enable system-level co-design.
Run end-to-end simulation workflows including EM extraction, S-parameter generation, PDN impedance analysis, crosstalk/eye diagram simulations, thermal/structural reliability checks, and co-simulation across domains.
Collaborate directly with EDA vendors (Cadence, Ansys, Synopsys, Siemens, Keysight, etc.), OSATs, and foundries to develop, test, and refine package simulation flows.
Generate user guides, reference flows, scripts, and automation that make SI/PI/multiphysics enablement repeatable and accessible to design teams.
Stay current with next-gen interface standards (PCIe Gen6/7, CXL, UCIe, UALink, SerDes, HBM) and incorporate their requirements into package design methodologies.
Guide technical strategy for SI/PI flows, mentor junior engineers, and represent TIE in working groups, customer design reviews, and industry forums.
Other related functions as assigned.

Benefits

Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
Voluntary Vision, Dental, Life, and Disability insurance options
Generous paid vacation, sick time, and holidays
Teachers Retirement System of Texas, a defined benefit retirement plan, with employer matching funds
Additional Voluntary Retirement Programs: Tax Sheltered Annuity 403(b) and a Deferred Compensation program 457(b)
Flexible spending account options for medical and childcare expenses
Robust free training access through LinkedIn Learning plus professional conference opportunities
Tuition assistance
Expansive employee discount program including athletic tickets
Free access to UT Austin's libraries and museums with staff ID card
Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card