About The Position

The Texas Institute for Electronics (TIE) is a transformative, well-funded semiconductor foundry venture combining the agility of a startup with the scale of a national initiative. The purpose of this role is to drive the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms, ensuring alignment between engineering execution, market needs, and business objectives. By serving as the bridge between technical teams and customer requirements, you will facilitate cross-functional collaboration and strategic partnerships to enhance product success and industry presence.

Requirements

  • BS in Electrical Engineering, Computer Engineering, or a related technical discipline.
  • Senior Product Manager: 5+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development.
  • Principal Product Manager: 10+ years of experience in semiconductor packaging, microsystems integration, or related microelectronics product development.
  • Proven expertise in advanced packaging technologies.
  • Working knowledge of semiconductor fabrication processes and electronic design automation (EDA) flows.
  • Exceptional communication skills.
  • Startup DNA: energized by ambiguity and urgency.
  • Execution mindset: demonstrated experience driving progress across multiple initiatives.

Nice To Haves

  • MS or PhD in Electrical Engineering, Computer Engineering, Mechanical Engineering, Materials Science, or a related field.
  • Proven program management experience.
  • Experience working directly with subcontractors, vendors, or external partners.
  • Prior experience at a leading semiconductor foundry or packaging house.

Responsibilities

  • Own the product strategy and roadmap for TIE’s advanced 2.5D/3D microsystems integration platforms.
  • Author and maintain comprehensive Product Requirements Documents (PRDs).
  • Drive cross-functional collaboration across internal teams.
  • Engage closely with customers and industry partners.
  • Serve as a technical champion for 2.5D/3D integration.
  • Develop and execute detailed program plans.
  • Create technical documentation and collateral.
  • Monitor advanced packaging market trends and competitive developments.
  • Champion a culture of accountability and transparency across all product workstreams.
  • Other related functions as assigned.

Benefits

  • Competitive health benefits (employee premiums covered at 100%, family premiums at 50%)
  • Voluntary Vision, Dental, Life, and Disability insurance options
  • Generous paid vacation, sick time, and holidays
  • Teachers Retirement System of Texas, with 8.25% employer matching funds
  • Flexible spending account options for medical and childcare expenses
  • Robust free training access through LinkedIn Learning
  • Tuition assistance
  • Expansive employee discount program including athletic tickets
  • Free access to UT Austin's libraries and museums with staff ID card
  • Free rides on all UT Shuttle and Austin CapMetro buses with staff ID card

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What This Job Offers

Job Type

Full-time

Career Level

Senior

Education Level

Bachelor's degree

Number of Employees

251-500 employees

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