As a Senior Optical Packaging Engineer with expertise in low-cost and high-volume optical manufacturing processes of high-performance transceivers, you will own the critical alignment process development of fiber array to PIC; PIC-to-Chip; Chip-to-Chip as well as influence the equipment selection and process optimization for all necessary optical assembly steps. Additional responsibilities include: Technical ownership of optical transceiver assembly process development, especially silicon photonics optical coupling and free space optics assembly using modern manufacturing methods. Deliver highly automated, high volume, and economical manufacturing process solution, which meets performance and cost targets while ensuring scalability and reliability. Propose and plan process optimization for optical assembly processes, conduct and carry out the necessary experiments and analysis to optimize process throughput, process windows, and yield. Manage process transfer to Operations, including documentation, for product introduction at a contract manufacturer. Design of custom solutions for mechanical assembly automation, including software and electronic hardware integration, as well as fixturing and other mechanical components. Collaborate with design, test, and reliability engineers to optimize product testability, manufacturability, and quality.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees