Senior Mixed Signal Design Engineer

RTX•Goleta, CA

2d•Onsite

About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. Raytheon Vision Systems is seeking a talented Senior Mixed Signal Design Engineer to join our design team. As part of this team, you will collaborate in a fast-paced multidisciplinary team environment to develop cutting-edge image sensor products. You will participate in mixed-signal ASIC/ROIC development activities with cross-functional teams including chip architecture, specification, design, verification, validation, fabrication, packaging, debugging, test development, failure analysis, and documentation. This position will be onsite in Goleta, CA or Pheonix, AZ.

Requirements

Typically requires a degree in Science, Technology, Engineering or Mathematics (STEM) with a minimum of 5 years of prior relevant experience or an Advanced Degree in a related field and a minimum of 3 years of experience.
Experience with full-custom CMOS Integrated Circuit (IC) design at the transistor level using IC Design Flows and tools.
Experience with CAD tools such as Cadence and Mentor Graphics (Siemens), with analysis and programming tools such as MATLAB, and with computer programming or scripting languages such as Python.
Experience with high-end UNIX based software design tools for circuit simulation and analysis such as noise analysis and for physical design, automation, and verification.
Modelling experience with System Verilog/Real Modelling/Verilog AMS and coding synthesizable RTL.

Nice To Haves

Advanced digital design skills such as experience with Conformal, experience with Digital-on-top mixed-signal design flow including utilization of Innovus for final chip construction, and experience writing behavioral models for digital circuits and analog/mixed signal interfaces and circuits.
Experience with certain IP and circuit blocks such as LVDS transmitters and receivers, low noise and low power amplifiers, ADC design, PLL/Transmitter design and radiation and cryogenic tolerant design techniques.
Familiarity with ROIC architecture, design concepts, operational control and timing, with prior experience successfully executing quick turn developments for commercial, defense, and/or space industries.
Knowledge of semiconductor device physics, semiconductor processing, physical design (including the ability to perform hand layout of critical analog & mixed-signal circuits) and testing.
Advanced degree is preferred.

Responsibilities

Design, development, and verification of read-out ICs (ROICs) for visible and infrared focal plane arrays.
Evaluate various aspects of the process flow from design to synthesis, place and route, timing and power use.
Determine architecture design, logic design, and system simulation and define module interfaces for simulation.
Design mixed-signal integrated circuits for image sensors, including analog signal chain, digital timing and image processing, and low-power 12 – 14 bit on-chip analog to digital converters (ADCs).
Guide the successful completion of major design tasks and may function in a project leadership role, which can include technical leadership, budget, schedule, and metrics tracking.