Senior Member of Technical Staff (CMP) Engineer

Intel CorporationHillsboro, OR
5dHybrid

About The Position

Shape the Future of Semiconductor Innovation at Intel Foundry Organization Overview Manufacturing Development Customer Engineering (MDCE) is a newly established organization within Intel Foundry Technology Manufacturing and is focused on accelerating technology ramp and manufacturing excellence. Our mission is to seamlessly transition cutting-edge technologies from development to high-volume production while making technology ramp a key competitive differentiator for Intel Foundry. Position Summary MDCE is seeking a Senior Member of Technical Staff (CMP) Engineer to drive module ownership and technical leadership across Intel's most advanced logic technologies (18A, Intel 3, Intel 12nm). This role requires a seasoned professional who can navigate the complexities of process development, cross-node standardization, and high-volume manufacturing readiness while delivering exceptional results for both Intel products and foundry customers.

Requirements

  • Master's degree in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
  • 7+ years of experience in semiconductor manufacturing / process development or technology development
  • 4+ years of direct experience in Chemical Mechanical Planarization (CMP) process development experience with hands-on process tuning and characterization
  • Experience with major CMP equipment platforms in one of the following platforms (AMAT, Ebara, etc.)
  • Experience with CMP consumables (e.g. slurries, pads, conditioning disks, filters, clean chemistries)
  • Previous semiconductor foundry experience

Nice To Haves

  • Doctorate in Chemical Engineering, Materials Science, Electrical Engineering, Mechanical Engineering, Physics, or related technical field
  • Experience with advanced technology nodes (e.g. sub-10nm logic, specifically in Gate All Around (GAA) architectures with track record of successful technology development and HVM implementation
  • Cross-functional leadership experience, including task force leadership for yield improvement initiatives
  • Experience with CMP integration with other process modules (e.g. deposition, lithography, etch, clean) and CMP-relevant metrology with understanding of CMP impact on device performance and yield.
  • Experience with CMP-relevant metrology and process control (e.g. thickness, topography, defects, roughness, particles)

Responsibilities

  • Technical Leadership Process Development & Optimization: Lead CMP process development from concept through HVM implementation across multiple advanced technology nodes
  • Cross-Node Alignment: Drive standardization and best practices across Intel's technology portfolio to maximize efficiency and yield
  • Problem Resolution: Own and resolve complex CMP-related yield and manufacturing issues using data-driven approaches and structured problem-solving methodologies
  • Customer-Centric Delivery: Align technical strategies with customer requirements and business objectives, ensuring on-time delivery of robust solutions
  • Technology Transfer: Bridge technology development and manufacturing teams to ensure smooth transition of CMP processes to production
  • Continuous Improvement: Drive ongoing optimization initiatives to enhance process capability, yield, and manufacturing efficiency
  • Cross-Functional Partnership: Work closely with Integration, Device, Yield, Factory, Quality, and Customer Engineering teams
  • Supplier Engagement: Collaborate with equipment and consumables suppliers to co-develop and optimize CMP solutions
  • Team Development: Mentor junior engineers and provide technical guidance across the organization

Benefits

  • We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
  • Find out more about the benefits of working at Intel.
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