Senior Mechanical Engineer- RF Packaging

Astranis • San Francisco, CA

2d

About The Position

As an Astranis Senior Mechanical Engineer for Electronics Packaging you will own the complete lifecycle of various components and subsystems on our spacecraft. Whether it is incremental improvements or the introduction of a new system, you will work together with the various other teams at Astranis to make them a reality. In addition to being a significant individual on your own, you will mentor and train junior mechanical engineers on such projects. You must have a strong problem-solving background, hands-on testing skills, and preferably some experience with spacecraft and/or aerospace engineering.

Requirements

• B.S. or M.S in mechanical, electrical, aerospace engineering, or equivalent
• 4 - 15+ years of mechanical design or equivalent experience
• 3+ years designing, analyzing, and testing active or passive high frequency RF electronics packages. Examples include phased array antenna packaging, SSPAs, waveguide assemblies, feedplanes, filters, RF enclosures, and MUX/DEMUX.
• Familiarity with chip and wire and splitblock construction
• Strong CAD design and Finite Element analysis skills
• Experience with GD&T and designing for manufacturability
• Demonstrated ability to personally design, evaluate, and procure complex mechanical assemblies with 30-40 components in aerospace or similar
• A passion for hardware development, including working in a fast-paced environment with hands-on design and development
• A motivated leader who has experience mentoring and supporting junior engineers
• U.S. Citizenship, Lawful Permanent Residency, or Refugee/Asylee Status Required (To comply with U.S. Government space technology export regulations, applicant must be a U.S. citizen, lawful permanent resident of the United States, or other protected individual as defined by 8 U.S.C. 1324b(a)(3))

Nice To Haves

• Experience with Ku, Ka, and Q/V band electronics package development for space missions
• Experience with thermal analysis and thermal management techniques for RF electronics in space applications, including with heat pipes
• Experience with vibration environments and mechanical testing on spacecraft components
• Experience with brazed construction techniques for RF packages
• Experience in synthesizing requirements and flowing them down to sub-scale verification builds and testing

Responsibilities

• Complete ownership of product outcomes for spaceflight hardware, with a focus on high frequency active and passive RF and digital electronics
• Develop requirements for subsystems and components including loads, interfaces, and functional requirements
• Perform mechanical design and analysis of complex electronics enclosures to satisfy launch and on-orbit requirements
• Develop and define design best practices for future programs
• Manage system level schedule and integration requirements for your components while working together with the Assembly, Integration, and Test team to enable a smooth build process
• Assist in recruiting, interviewing, and hiring additional teammates to our rapidly-growing team.

Benefits

• All our positions offer a compensation package that includes equity and robust benefits.
• Base pay is a single component of Astranis's total rewards package, which may also include equity in the form of incentive stock options, high quality company-subsidized healthcare, disability and life insurance benefits, flexible PTO, 401(K) retirement, and free on-site catered meals.
• Astranis pay ranges are informed and defined through professional-grade salary surveys and compensation data sources. The actual base salary offered to a successful candidate will additionally be influenced by a variety of factors including experience, credentials & certifications, educational attainment, skill level requirements, and the level and scope of the position.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Number of Employees: 251-500 employees