Senior Materials and Process Engineer - Microelectronics Packaging (Hybrid)
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About The Position
Because this role involves a combination of collaborative/in-person and independent work, it will take the form of a hybrid work format, with time split between working onsite and remotely. You don’t see it, but it’s there. Our employees work on the world’s most advanced electronics – from saving emissions in the City of Lights to powering the Mars Rover to protecting the F35 fighter jet. At Electronic Systems, you’ll be among the brightest minds, working on the aerospace and defense industry’s most difficult problems. Drawing strength from our differences, we’re innovating for the future. And you can, too. Our flexible work environment provides you a chance to change the world without giving up your personal life. We put our customers first – exemplified by our missions: “We Protect Those Who Protect Us®” and “We Innovate For Those Who Move The WorldTM.” Sound like a team you want to be a part of? Come build your career with BAE Systems. In Navigation and Sensor Systems, we design and manufacture state-of-the-art systems and technology that enable our customers to execute their precision navigation missions. BAE Systems is looking for an experienced Materials and Process Engineer with a passion for engineering and the desire to work in the world of Microelectronics Packaging Design. Our team needs engineers interested in designing and developing the Microelectronics packages needed for supporting the next generation of Global Positioning (GPS) products and other platforms that support the war fighter. The position offers abundant opportunity to design and develop state of the art miniaturized electronic devices. As a part of this team, you will have responsibilities spanning all phases of the engineering life cycle including design, process development, qualification, and factory support. The successful applicant should be knowledgeable in microelectronics packaging concepts and technologies.
