WGNSTAR-posted 3 months ago
Full-time
Baltimore, MD
Educational Services

WGNSTAR is a dynamic and growing company with a global footprint, primarily focused on the semiconductor industry. We're excited to be partnering directly with one of our valued clients to fill a key position on their team. This is a unique opportunity to contribute to meaningful work in an innovative environment.

  • Lead process and/or equipment engineering efforts utilizing Applied Materials (AMAT) tools, focusing on driving process optimization and enhancing equipment performance.
  • Collaborate with onsite AMAT FSO and engineering functions to improve various metrics including Process capability (CpK), Equipment availability, Tool down escalations, Maintenance to ratio (M-ratio), Mean Time to Repair (MTTR), Mean Time Between Failures (MTBF), Preventative Maintenance (PM) success rate, and PM on-time and in-time metrics.
  • Provide informal guidance to process and equipment engineers while collaborating and directing Customer Engineers (CEs) in both conference room and hands-on settings.
  • Create and review documents covering technical improvements, system upgrades, support plans, maintenance manuals, and process Best Known Methods (BKMs).
  • Serve as the primary point of contact for tool down escalations, liaising between AMAT and internal stakeholders such as Operations, Process Engineering, Equipment Engineering, and Site Director.
  • Analyze equipment performance and troubleshoot issues, driving data-based methodologies to enhance yield and efficiency.
  • Lead process optimization initiatives, developing and implementing strategies to resolve on-wafer issues and diagnostics of equipment.
  • Collaborate with local and cross-functional teams to develop BKMs for the operation and upkeep of ENDURA, CENTURA, and MIRRA tools.
  • Bachelor's degree in Science, Technology, Engineering or Math AND 12+ years of related experience; or Master's degree in same and 10 years of related experience.
  • Prior experience with leading OEMs and/or HVM fabs.
  • Proven expertise with 200mm or 300mm semiconductor equipment, such as ENDURA, CENTURA, PRODUCER, and/or MIRRA platforms.
  • Excellent analytical and problem-solving skills, capable of working independently and collaboratively in a team environment.
  • Demonstrated experience in leading projects, mentoring colleagues, and fostering a culture of continuous improvement.
  • Able to create and perform equipment and process partitioning to resolve hardware and/or process issues.
  • Skilled at interpreting and modifying diagrams and schematics to effectively troubleshoot and resolve hardware issues.
  • US CITIZENSHIP and ability to obtain and maintain a DoD Top Secret/SCI clearance with POLY REQUIRED.
  • Expertise in fingerprinting a wide range of Applied Materials (AMAT) equipment, including detailed assessments of hardware configurations, calibration parameters, and process variables.
  • Strong understanding of experimental design methodologies, specifically full factorial and fractional factorial designs.
  • Expertise in configuring and troubleshooting the ENDURA mainframe and process chambers, including optimization of processes to improve film uniformity, reduce defects, and increase overall throughput.
  • Expertise in CENTURA etch eMXP+ systems, specializing in high-aspect-ratio etches on silicon, metal and dielectrics.
  • Expertise in Centura CVD platforms to deposit high quality SIOx and SiN films, including modifying hardware and/or process.
  • Expertise in MIRRA DESICA CMP for fully automated dry-in/dry-out planarization, including endpoint detection for multi-platen polishing, expertise in metal damascene and dielectric planarization, and knowledge in slurry chemistry and pad conditioning.
  • Relocation assistance is available.
  • Pay Rate: Up to $245K. DOE.
  • Standard Schedule: Monday - Friday, 1st Shift; 9-80's also optional.
  • Full-Time, Client Direct Hire.
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