Senior Engineer, Semi Packaging Engineering

Analog Devices•San Jose, CA

1d•$109,940 - $151,168

About The Position

About Analog Devices Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at www.analog.com and on LinkedIn and Twitter (X). Job duties include but not limited to: New Product Introduction (NPI): New product package development from design through qualification up to release of the product to production. Development of new module package technologies working closely with the product design engineers and the factories. Business Unit (BU) communications: Communicate with design teams to understand the package requirements and to influence package-related design decisions for new product development. Assembly subcontractor/OSATs communications: work closely with ADI’s overseas assembly subcontractor/OSATs for new package development and other package-related engineering activities. Late afternoon/early evening conference calls and oversea travels are expected. Cross functional team collaborations: work closely with reliability team, business units, and supply chain management team to provide package-related engineering support. Project management: plan and drive for on time delivery of development projects. Package bill of material (BOM) selection: solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites. Package Design Rules: Develop and implement package design rules and other specifications for module assembly processes. Package model and drawing creation: Create package design models and drawings for package development, simulation, and documentation. Package process development: Develop materials, assembly processes, process control plans with material suppliers, assembly vendors during NPI. Perform process failure mode and effects analysis (FMEA), execute design of experiments (DOE), implement process change notification (PCN) Finite element analysis: experience in finite element analysis (thermal, stress, and electrical) is plus. Analog Devices, Inc. (NASDAQ: ADI ) is a global semiconductor leader that bridges the physical and digital worlds to enable breakthroughs at the Intelligent Edge. ADI combines analog, digital, and software technologies into solutions that help drive advancements in digitized factories, mobility, and digital healthcare, combat climate change, and reliably connect humans and the world. With revenue of more than $9 billion in FY24 and approximately 24,000 people globally, ADI ensures today's innovators stay Ahead of What's Possible™. Learn more at www.analog.com and on LinkedIn and Twitter (X). Come join ADI – a place where Innovation meets Impact. For more than 55 years, Analog Devices has been inventing new breakthrough technologies that transform lives. At ADI you will work alongside the brightest minds to collaborate on solving complex problems that matter from autonomous vehicles, drones and factories to augmented reality and remote healthcare. ADI fosters a culture that focuses on employees through beneficial programs, aligned goals, continuous learning opportunities, and practices that create a more sustainable future.

Requirements

Master’s degree in Mechanical Engineering, Materials Science and Engineering, Chemical Engineering, Applied Physics, or Electrical Engineering is required with 1-5 years of industrial working experience in related fields.
Knowledge in various packaging technologies, process flow, material, qualification, and manufacturing implementation.
Knowledge in IC package reliability requirements, failure analysis techniques, assembly process issues, etc.
For positions requiring access to technical data, Analog Devices, Inc. may have to obtain export licensing approval from the U.S. Department of Commerce - Bureau of Industry and Security and/or the U.S. Department of State - Directorate of Defense Trade Controls. As such, applicants for this position – except US Citizens, US Permanent Residents, and protected individuals as defined by 8 U.S.C. 1324b(a)(3) – may have to go through an export licensing review process.

Nice To Haves

Finite element analysis: experience in finite element analysis (thermal, stress, and electrical) is plus.

Responsibilities

New Product Introduction (NPI): New product package development from design through qualification up to release of the product to production.
Development of new module package technologies working closely with the product design engineers and the factories.
Business Unit (BU) communications: Communicate with design teams to understand the package requirements and to influence package-related design decisions for new product development.
Assembly subcontractor/OSATs communications: work closely with ADI’s overseas assembly subcontractor/OSATs for new package development and other package-related engineering activities.
Late afternoon/early evening conference calls and oversea travels are expected.
Cross functional team collaborations: work closely with reliability team, business units, and supply chain management team to provide package-related engineering support.
Project management: plan and drive for on time delivery of development projects.
Package bill of material (BOM) selection: solid understanding of mechanical, thermal, and electrical properties of materials, including semiconductors, metals, ceramics, and polymer composites.
Package Design Rules: Develop and implement package design rules and other specifications for module assembly processes.
Package model and drawing creation: Create package design models and drawings for package development, simulation, and documentation.
Package process development: Develop materials, assembly processes, process control plans with material suppliers, assembly vendors during NPI.
Perform process failure mode and effects analysis (FMEA), execute design of experiments (DOE), implement process change notification (PCN)