Senior Engineer I - Packaging

Microchip Technology Inc. • Chandler, AZ

1d

About The Position

This position for an Intermediate Package Development Engineer who will oversee and manage all aspects of IC package development from initial design and performance considerations, to package design optimization, determining design rules for manufacturing, selecting and interfacing with suitable technology and manufacturing partners and completing package qualification, cooperate with internal business unit designers, operations teams, and reliability resources, and final release products to production. The primary business unit requires packaging in flip chip BGA packaging using Cu Pillar Bump, high-density build-up substrates, multi-chip modules, system-in-package, and other leading-edge advanced packaging solutions. Responsibilities include the following: Work with the designated business units and co-design package solutions that meet the performance, thermal, and reliability requirements for the designated application space. Identify suitable IC package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with multiple third-party assembly sites as well as internal design groups, product engineering, and product marketing and act as the available expert resource for packaging-related aspects of the product. Ensure early success in package development with substantial modeling and simulation for thermal, mechanical and electrical aspects. In addition, act as the thermal and mechanical expert resource for product validation and application teams and end customers for support on system-level solutions. Oversee evaluation and development of new packaging materials and processes Manage qualifications of new packages or package changes to ensure quality and mitigate risk Author corporate and supplier-level presentations outlining package roadmaps and package technologies Author and maintain design rules documents and application notes on package-specific topics Draft preliminary package outline drawings for internal product development teams Initiate and follow up on assembly build instructions for all engineering builds Assist with global cost reduction, standardization and new system implementation projects

Requirements

• BSME, BSEE or BS in Chemical Engineering plus 5 years of experience
• Experience with advanced laminate (BGA) and QFN package design and assembly
• Well-developed knowledge of thermal & electrical simulations, ideally Siemens Flotherm or Ansys Workbench and related tools
• Experience with thermal design considerations, including heat sink design and selection
• Superior communication and presentation skills and the ability to lead a small team as needed including mentoring junior engineers
• Ability to problem-solve and assist the reliability group on FA’s on assembly related failures
• Knowledge of JEDEC qualification methods for advanced BGA and high-power IC's
• Ability to carry out multiple projects simultaneously, set timelines and prioritize projects
• Ability to author and comprehend engineering drawings
• Familiarity with ANSI Y-14 drafting nomenclature
• Travel to Asia occasionally to attend technology reviews and resolve subcon issues
• Competence in working with multiple databases, technical acronyms and complex data sets

Nice To Haves

• Package Design using Cadence APD
• High frequency/SI analysis knowledge

Responsibilities

• Work with the designated business units and co-design package solutions that meet the performance, thermal, and reliability requirements for the designated application space.
• Identify suitable IC package options and perform feasibility studies for all NPI (new product introduction), provide direct interface with multiple third-party assembly sites as well as internal design groups, product engineering, and product marketing and act as the available expert resource for packaging-related aspects of the product.
• Ensure early success in package development with substantial modeling and simulation for thermal, mechanical and electrical aspects.
• Act as the thermal and mechanical expert resource for product validation and application teams and end customers for support on system-level solutions.
• Oversee evaluation and development of new packaging materials and processes
• Manage qualifications of new packages or package changes to ensure quality and mitigate risk
• Author corporate and supplier-level presentations outlining package roadmaps and package technologies
• Author and maintain design rules documents and application notes on package-specific topics
• Draft preliminary package outline drawings for internal product development teams
• Initiate and follow up on assembly build instructions for all engineering builds
• Assist with global cost reduction, standardization and new system implementation projects

Benefits

• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive base pay, restricted stock units, and quarterly bonus payments.
• In addition to these components, our package includes health benefits that begin day one, retirement savings plans, and an industry leading ESPP program with a 2 year look back feature.
• Find more information about all our benefits at the link below: Benefits of working at Microchip
• The annual base salary range for this position, which could be performed in the US, is $70,304 - $205,000.
• Range is dependent on numerous factors including job location, skills and experience.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level