Senior Engineer, Failure Analysis | EAG Laboratories

Eurofins Scientific•Irvine, CA

29d•Onsite

About The Position

Our laboratory in Irvine, CA, provides test, engineering, and reliability services to a broad spectrum of technology-based sectors. We are proud to support our clients who range from startup stages to Fortune 500 global industry leaders. Our failure analysis staff succeed within a challenging but inspiring world of innovation; helping to support our clients research, develop, understand, and refine technologies that shape consumer electronics, medical device, automotive, military, aerospace, and manufacturing industries, just to mention a few. We demonstrate a hands-on approach to technical expertise by utilizing leading-edge methods and tools to attain insight that fuel engineering. If you enjoy being immersed in technology, dreaming about the future, tackling challenges head-on, problem-solving through teamwork, flexing your technical abilities and taking pride in accomplishments, then join us to live this every day. Examples of the type of investigations: Identified a semiconductor fabrication defect as well as a design related issue within a non-functioning, first version product to be used in a novel medical application: With this failure insight, the client was able to quickly implement appropriate changes and corrections to the manufacturing and redesign, producing a working product to further their new product launch activities. Isolated and identified the exact root cause of a product failure in the field, to a manufacturing event produced uniquely by a particular production step: With this information, the client was able to initiate a strategic containment plan to recall/quarantine the affected lot to avert catastrophic failures before they occurred. This helped prevent a larger public incident that could have damaged their product reliability and brand reputation. In this role, you will employ a variety of advanced tools and techniques to help support diverse aspects of a client's needs, which includes conducting technical discussions to understand the scope and expectations, designing and executing appropriate analytical plan/method, consulting with value-added insight and result interpretation, and recommending suitable next steps. As a senior member of the team, you will be responsible working alongside your peers and/or leading teams of engineers in the lab. The role will include aspects of project management, job planning, multi-disciplinary problem solving, legal projects and other complex client issues and requests. This is a dynamic role where you will be exposed to an ever-changing and evolving array of samples, tools and techniques on the path of innovation. If this role and the types of cases excite you, and you welcome daily challenges and are comfortable working in a fast-paced environment with a team-centric approach to solving problems, we encourage you to apply.

Requirements

This role is subject to the International Traffic in Arms Regulations (ITAR) therefore all accepted applicants must be U.S. Persons as defined by ITAR: U.S. Person is a U.S. Citizen, U.S. Permanent Resident (i.e., "Green Card Holder"), Political Asylee, or Refugee.
Employees are expected to comply with ISO 27001 standard and company requirements for Information security.
BSEE is required
10+ years of direct, hands-on Failure Analysis laboratory experience (semiconductor and electronics industry)
Experience and knowledge in the following: Semiconductor, materials analysis, electronics manufacturing, design, etc.
Required Hands-on experience/expertise: Root cause failure analysis Fault isolation techniques: OBIRCH, XIVA, emmi, IR Thermography Electrical Test/Measurements: ATE datalog, Curve trace, Bench test (parametric analyzer, o-scopes, CV measurement, LCR meter, etc.) Microprobing/Picoprobing X-ray (2D) SEM/EDS
Working knowledge of: Device physics, circuits/schematics, analog/digital circuits, IC design DPA, Mil-Std, AEC, JEDEC, IPC, etc. Semiconductor fabrication/process, yield enhancement Manufacturing, IC package assembly NPI, Reliability/Qualification testing
Able to develop new methods or techniques
Excellent English communication skills (written and spoken)
A strong work ethic with a commitment to accuracy
The ability to work to deadlines in a team-oriented environment are essential
Must be able to remain in a stationary position up to 80% of the time.
Ability to continuously operate a personal computer or lab equipment for extended periods of time (4 or more hours).
Ability to operate a keyboard and other lab equipment, use a telephone, access file cabinets and other items stored at various levels, including overhead
Ability to communicate clearly and understandably ensure an accurate exchange of information in normal conversational distance, over the telephone, and in a group setting.
Ability to handle small and fragile devices with tweezers and /or fingers.
Require close distance visual acuity with or without correction (Glasses, Contacts, etc.)
Must be willing and able to wear PPE such as hard-hat, steel-toed shoes, safety glasses, laboratory coat and/or any other devices or equipment that is required.
Learn new tasks, remember processes, maintain focus, complete tasks independently, make timely decisions in the context of a workflow, ability to communicate with visitors, ability to complete tasks in situations that have a speed or productivity quota.
Ability to move equipment or items up to 50 lbs.

Nice To Haves

Experiences as a technical lead, manager or mentor are highly desired
Highly desired Hands-on experience/expertise: LVP/LTP, SDL/LADA DBFIB, PFIB X-ray (CT/3D) Scanning Acoustic Microscopy (C-SAM). Deprocessing (RIE, parallel lapping, PFIB, etc.) Chemical etching (decapsulation, HF, acids/bases, delineation, etc.). Plasma etching (RIE, ICP, CF4, etc.) Cross sectioning (metallurgical, ion mill, DB FIB, etc.) Nanoprobing FinFET and advanced node technology DPA (Destructive Physical Analysis) Software: GDS layout, LabView