About the position
Our laboratory in Irvine, CA, provides test, engineering, and reliability services to a broad spectrum of technology-based sectors. We are proud to support our clients who range from startup stages to Fortune 500 global industry leaders. Our failure analysis staff succeed within a challenging but inspiring world of innovation; helping to support our clients research, develop, understand, and refine technologies that shape consumer electronics, medical device, automotive, military, aerospace, and manufacturing industries, just to mention a few. We demonstrate a hands-on approach to technical expertise by utilizing leading-edge methods and tools to attain insight that fuel engineering. If you enjoy being immersed in technology, dreaming about the future, tackling challenges head-on, problem-solving through teamwork, flexing your technical abilities and taking pride in accomplishments, then join us to live this every day.
Responsibilities
- Employ a variety of advanced tools and techniques to support diverse aspects of a client’s needs.
- Conduct technical discussions to understand the scope and expectations.
- Design and execute appropriate analytical plans/methods.
- Consult with value-added insight and result interpretation.
- Recommend suitable next steps.
- Work alongside peers and/or lead teams of engineers in the lab.
- Manage projects, job planning, and multi-disciplinary problem solving.
Requirements
- BSEE is required.
- 10+ years of direct, hands-on Failure Analysis laboratory experience (semiconductor and electronics industry).
- Experience and knowledge in semiconductor, materials analysis, electronics manufacturing, design, etc.
- Experiences as a technical lead, manager or mentor are highly desired.
- Hands-on experience/expertise in root cause failure analysis and fault isolation techniques.
- Electrical Test/Measurements: ATE datalog, Curve trace, Bench test (parametric analyzer, o-scopes, CV measurement, LCR meter, etc.).
- Microprobing/Picoprobing, X-ray (2D), SEM/EDS.
Nice-to-haves
- Hands-on experience/expertise in LVP/LTP, SDL/LADADBFIB, PFIB, X-ray (CT/3D), Scanning Acoustic Microscopy (C-SAM).
- Deprocessing (RIE, parallel lapping, PFIB, etc.), Chemical etching (decapsulation, HF, acids/bases, delineation, etc.).
- Plasma etching (RIE, ICP, CF4, etc.), Cross sectioning (metallurgical, ion mill, DB FIB, etc.).
- Nanoprobing, FinFET and advanced node technology, DPA (Destructive Physical Analysis).
- Software: GDS layout, LabView.
- Working knowledge of device physics, circuits/schematics, analog/digital circuits, IC design.
Benefits
- Compensation Range: $125,000-$160,000/yr.
- Career development programs and goal setting.
- Mentorship and growth as a leader.
- Diversity and inclusion initiatives.
