Senior Electrical Engineer - Packaging ONSITE

RTX

78d • $82,000 - $164,000

About The Position

At Raytheon, the foundation of everything we do is rooted in our values and a higher calling – to help our nation and allies defend freedoms and deter aggression. We bring the strength of more than 100 years of experience and renowned engineering expertise to meet the needs of today’s mission and stay ahead of tomorrow’s threat. Our team solves tough, meaningful problems that create a safer, more secure world. The Raytheon Effector Sub-System Products Department is currently seeking an Electrical Engineer to serve in the role of Senior Electrical Engineer for the Advanced Front-End Hardware organization in Atlanta, GA. This Engineer will develop leading-edge miniaturized sensors and systems to enable future generation technologies across RTX. This role will work closely with the Microelectronics Packaging and Design teams in El Segundo, CA. This role is based 100% ONSITE in Atlanta, Georgia.

Requirements

• Bachelor of Science degree in an Electrical Engineering discipline.
• Minimum of five (5) years of related Electrical Engineering work experience inclusive of Graduate Level Research and Internship experience.
• Design experience with 3D and 2.5D packaging.
• Circuit layout design experience using 2D CAD tools such as HFSS, Cadence Virtuoso/Celsuis or Allegro/APD+.
• The ability to obtain and maintain a U.S. government issued security Secret clearance.
• U.S. citizenship is required, as only U.S. citizens are eligible for a security clearance.

Nice To Haves

• Master's or Ph.D. in Electrical Engineering.
• Experience with development, documentation, fabrication, assembly, and test/delivery of military electronic products.
• Experience with electrical engineering design.
• Experience with airborne environmental requirements and design constraints.
• Experience with CREO/Pro-Engineer CAD modeling and analysis tools.
• Experience in Geometric Dimensioning and Tolerance analysis for drawings.

Responsibilities

• Work with cross-functional hardware engineering teams to develop architecture solutions for airborne radar antenna arrays.
• Design high density microelectronic packaging and electronic components/devices such as ASICs and FPGAs.
• Design electronic packaging chassis and structures, interconnects, and thermal control for high-density electronic systems.
• Follow established procedures in the creation of technical data package work products.
• Collaborate with program management and functional supervision to ensure overall design objectives are met.
• Implement innovative solutions to challenging design criteria.
• Involved in product development from beginning to end, including documentation, fabrication, assembly, and test/delivery of military products.

Benefits

• Medical, dental, vision, life insurance.
• Short-term disability, long-term disability.
• 401(k) match.
• Flexible spending accounts.
• Flexible work schedules.
• Employee assistance program.
• Employee Scholar Program.
• Parental leave.
• Paid time off and holidays.

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Education Level: Bachelor's degree
• Number of Employees: 5,001-10,000 employees