Senior Director, Package Engineering

PsiQuantum • Milpitas, CA

9h

About The Position

PsiQuantum’s mission is to build the first useful quantum computers—machines capable of delivering the breakthroughs the field has long promised. Since our founding in 2016, our singular focus has been to build and deploy million-qubit, fault-tolerant quantum systems. Quantum computers harness the laws of quantum mechanics to solve problems that even the most advanced supercomputers or AI systems will never reach. Their impact will span energy, pharmaceuticals, finance, agriculture, transportation, materials, and other foundational industries. Our architecture and approach is based on silicon photonics. By leveraging the advanced semiconductor manufacturing industry—including partners like GlobalFoundries—we use the same high-volume processes that already produce billions of chips for telecom and consumer electronics. Photonics offers natural advantages for scale: photons don’t feel heat, are immune to electromagnetic interference, and integrate with existing cryogenic cooling and standard fiber-optic infrastructure. In 2024, PsiQuantum announced government-funded projects to support the build-out of our first utility-scale quantum computers in Brisbane, Australia, and Chicago, Illinois. These initiatives reflect a growing recognition that quantum computing will be strategically and economically defining—and that now is the time to scale. PsiQuantum also develops the algorithms and software needed to make these systems commercially valuable. Our application, software, and industry teams work directly with leading Fortune 500 companies—including Lockheed Martin, Mercedes-Benz, Boehringer Ingelheim, and Mitsubishi Chemical—to prepare quantum solutions for real-world impact. Quantum computing is not an extension of classical computing. It represents a fundamental shift—and a path to mastering challenges that cannot be solved any other way. The potential is enormous, and we have a clear path to make it real. Come join us. Job Summary: The Senior Director of Packaging Engineering will manage a team of opto-mechanical package design engineers and be responsible for subassembly and BOX designs with quality for RD and volume system integration and deployment at PsiQ QC (quantum computer) sites. This role requires good engineering disciplines in thermal, mechanical and optical designs and associated quality standard, a strong “can do” attitude in a fast-paced environment, problem-solving, excellent communication with teams across multiple disciplines.

Requirements

• Experience working within small startup and/or large companies managing opto-mechanical packaging teams with proven track record to bring product in volume (e.g in datacom, telecom optical communication industry).
• Experienced with optical and photonics systems; Cryogenic system experience is a plus.
• Familiar with key opto-mechanical packaging supplier base and the quality system.
• Demonstrated ability to manage short deadlines, and to follow a disciplined work process.
• Able to work in a fast-paced environment.
• Ability to build relationships with multiple groups with strong interpersonal, communication skills to be able to work with all levels of the organization from the founders of the company to techs.
• A lead by example person, lead from the front attitude when all hands-on-deck situations arise, get involved in day-to-day tasks to assure peak performance and safe work environment for everyone
• Master’s degree or higher in an applicable engineering discipline, such as Mechanical Engineering, Optical Engineering, or Applied Physics.
• 15+ years of experience applying engineering principles to solve complex thermal, mechanical and optical problems.
• Proficient in 2D & 3D packaging tools (Solidworks), thermal, structure and stress simulation (Ansys) and measurement tools with hands-on experience.
• Experience in design, analysis and assembly of subsystems, NPI and manufacture support including supplier management.
• Excellent written and verbal communication skills; Self-starter.
• Demonstrated strong analytical and problem-solving skills.
• Ability to provide technical leadership in ambiguous situations.
• Strong management skills.

Responsibilities

• Design subassemblies and boxes for QC sub-systems with electronics and silicon photonics chips for both cryogenic and room temperature environment in vacuum systems.
• Establish and maintain design flow, conduct design reviews with necessary mechanical, thermal, structural, stress analysis from simulation and measurement - to meet design target and requirement by sub-system team.
• Work with cross functional team and suppliers on DFM, FMEA to finalize design, and support process team to finalize assembly process flow; Release design document in the system with change controls.
• Work with supply chain and suppliers to deliver and verify first article piece parts and provide reports vs. design.
• Support process team of the initial sub-assembly build and related verification per FMEA and DFM; and follow on piece part quality control.
• Manage budget, capex, hiring per AOP including associated CAD tool licenses and machines.
• Project-managing and deliverable, execution milestone, schedule tracking for internal and external suppliers.

What This Job Offers

• Job Type: Full-time
• Career Level: Director
• Number of Employees: 501-1,000 employees