Senior Director of PIC Engineering

QCi-posted 3 months ago

Senior

11-50 employees

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Quantum Computing Inc. (QCi) (Nasdaq: QUBT) is an innovative, integrated photonics company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company’s portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cyber security as well as remote sensing applications. The Senior Director of PIC Engineering will lead the design, development, and production of advanced Photonic Integrated Circuits (PIC) leveraging TFLN (Thin-Film Lithium Niobate) and Silicon Photonics technology. This role combines deep expertise in photonic device engineering with strategic leadership to drive innovation, manage multidisciplinary teams, and deliver high-performance PIC solutions for applications in quantum computing, communications, sensing, and photonics signal processing.

Define the vision, strategy, and roadmap for TFLN/ Silicon PIC technology development aligned with corporate goals.
Lead the architecture, simulation, design, and fabrication of high-performance TFLN/ Silicon -based photonic devices and circuits (e.g., modulators, filters, frequency shifters).
Drive innovation in TFLN/ Silicon process integration, wafer bonding, and hybrid/heterogeneous integration with other photonic platforms.
Represent engineering in executive reviews, customer meetings, and industry events.
Oversee end-to-end PIC product development lifecycle — from concept, design, and prototyping to validation, qualification, and transfer to manufacturing.
Collaborate with foundry partners to optimize TFLN/ Silicon fabrication processes, yield, and scalability for high-volume production.
Ensure device performance meets or exceeds design specifications across optical bandwidth, RF bandwidth, insertion loss, and power handling.
Build, mentor, and manage a high-performing team of PIC design, process, test, and packaging engineers.
Foster a culture of technical excellence, collaboration, and accountability.
Set performance objectives, conduct reviews, and create career development plans.
Establish robust design verification and validation protocols for TFLN/ Silicon devices.
Drive continuous improvement in simulation models, design automation, and manufacturing workflows.
Ensure compliance with industry standards, IP protection, and regulatory requirements.

Master’s degree in Electrical Engineering, Physics, Optics, or related field (PhD preferred).
5-10 years experience in photonic device and PIC engineering.
Proven track record of delivering PIC products using TFLN/ Silicon technology.
Background in and deep understanding of quantum photonics.
Deep understanding of TFLN/ Silicon device physics, electro-optic modulation, RF-optical co-design, and thermal management.
Expertise with PIC design tools (e.g., Lumerical, OptoDesigner, Ansys, COMSOL) and fabrication process flows.
Experience managing external foundry relationships, PDK development, and technology transfer to manufacturing.
Excellent leadership, communication, and cross-functional collaboration skills.

PhD degree in Electrical Engineering, Physics, Optics, or related field.
Previous experience in people management.
Knowledge of hybrid integration with silicon photonics, InP, or SiN platforms.
Experience in high-speed optical communications (>100 GHz), quantum photonics systems using TFLN.
Demonstrated success in building and protecting IP portfolios in photonics.
Familiarity with wafer-level testing, optical packaging, and system-level integration.

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