Skyworks-posted 3 months ago
$178,400 - $376,700/Yr
Full-time • Senior
Greensboro, NC
Computer and Electronic Product Manufacturing

The MSB Director DFT/DFM owns the end-to-end design quality strategy for MSB's highly integrated RF front-end modules - power amplifiers, LNAs, CMOS controllers, SOI switches, duplexers, and laminate MCMs. From initial concept and architecture definitions through high-volume production, you will: Architect and enforce Design For Test (DFT) and Design For Manufacturing (DFM) methodologies. Establish required checklists, templates and automations at each level(IP/Block Level/Module Level) for a cohesive DFT/DFM design flow. Drive IP design teams to ensure IP manufacturability and testability. Ensure process and temperature compensations strategies/circuits are in place. If trimming is applied, ensure dynamic range is available to meet required compensation. Vet new technology to ensure it is fully ready for customer ramps. Drive block level design teams (e.g., ASM/PA/LNA) to ensure block assembly manufacturability and testability. Drive module design teams to ensure module level manufacturability and testability. Collaborate with the design and customer quality teams to ensure that lifetime testability is considered at both the circuit and architecture levels. Build and mentor a high-caliber engineering team embedded with our module design teams to deliver zero-defect designs and rapid high yield ramps.

  • Define, lobby for and enforce DFT/DFM methodologies and checklists at each module phase (Architecture/DEV/P0/P1)
  • Drive periodic ATE and FI yield and coverage reviews at each module phase (DEV/P0/P1)
  • Ensure early comprehensive ATE coverage
  • Drive to 100% coverage of customer GBT module specifications
  • Collaborate with Product and Test teams to ensure test coverage and roadmaps are defined clearly for each module
  • Specify and deploy new or unique test capabilities (ET metrics, OOB rejection, harmonic coverage) when required
  • Drive robust trim algorithm documentation and execution
  • Develop a seamless process to ensure design optimization inputs are documented, communicated, executed and validated at product test
  • Ensure robust die-probe plans are defined early and executed with a determined timeline
  • Lead statistical vetting of new technology nodes, new materials and newly released IP
  • Serve as overall RMA leader, coordinating with customer quality team and module teams to quickly and robustly close customer RMAs
  • Establish a methodical and standardized RMA debug methodology; train and support DRIs for utilizing this process
  • Collaboration with IP team and participation in architecture reviews for new IP blocks
  • Partner with Product and Test Engineering to deliver on-time histograms, full test coverage, and high-yield ramps
  • Attract, develop, retain top engineering talent
  • BSEE with 15+ years, or MSEE/PhD with 10+ years, in RF-engineering leadership roles
  • Proven ability to lead across multiple teams and divisions/sites
  • Deep experience with RFIC components (Switch, LNA, PA, filters) and process technologies (CMOS, GaAs/Silicon HBT, SOI, BiCMOS)
  • Proficiency with RF measurement equipment (VNAs, spectrum analyzers, power meters, signal generators)
  • Expertise in statistical methods for product and test, including yield analysis and production control
  • Demonstrated leadership: active listening, constructive feedback, and motivational communication
  • Demonstrated track record of methodical problem solving
  • Excellent written and verbal communication and strong customer-presentation skills
  • Ability to thrive under pressure and foster collaboration in high-stakes situations
  • Access to healthcare benefits (including a premium-free medical plan option)
  • 401(k) plan and company match
  • Employee stock purchase plan
  • Paid time off (including vacation, sick/wellness, parental leave)
  • Participation in an incentive plan
  • Eligibility for additional awards, including recognition and stock based on performance
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