Senior Director, Engineering - CHS Package Design
About The Position
We are seeking a Senior Director of Engineering to lead and grow our package design team within CHS, driving next-generation high-performance compute (HPC) package and system architectures for client compute and datacenter platforms. This leader will own the end-to-end package design strategy — from concept through production — and will be responsible for building a world-class team that delivers differentiated solutions leveraging advanced 2.5D and 3D integration technologies. The ideal candidate brings deep technical expertise in multi-chiplet packaging, silicon interposer and bridge architectures, and high-density interconnect design, combined with a proven track record of leading large, cross-functional engineering organizations. The role requires strong competency in high-speed IO system design, signal and power integrity simulation, and thermal/mechanical co-design for advanced package substrates. The successful candidate will partner closely with silicon design, platform architecture, and manufacturing teams to define package technology roadmaps that meet aggressive performance, power, and cost targets across Qualcomm's compute portfolio. Experience navigating OSAT and foundry ecosystems, driving design-for-manufacturability, and influencing industry standards is highly valued. This is a senior leadership position that demands both strategic vision and hands-on technical credibility.
Requirements
- Bachelor's degree in Science, Engineering, or related field
- 15+ years of IC package and system design
- Solid understanding and experience in high speed IO package and system design
- Expert knowledge in design tool such as Cadence Allegro/APD/Sip or Mentor Xpedition
- Proficiency in field solvers such as Ansys HFSS, Q3D and PSI
- Proficiency in simulation tools such as ADS and Hspice
- Bachelor's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 10+ years of System/Package Design/Technology Engineering or related work experience
- Master's degree in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 9+ years of System/Package Design/Technology Engineering or related work experience
- PhD in Chemical Engineering, Electrical Engineering, Mechanical Engineering, or related field and 8+ year of System/Package Design/Technology Engineering or related work experience
- Deep technical expertise in multi-chiplet packaging, silicon interposer and bridge architectures, and high-density interconnect design
- Proven track record of leading large, cross-functional engineering organizations
- Strong competency in high-speed IO system design, signal and power integrity simulation, and thermal/mechanical co-design for advanced package substrates
Nice To Haves
- Experience navigating OSAT and foundry ecosystems
- Driving design-for-manufacturability
- Influencing industry standards
Responsibilities
- Lead and grow our package design team within CHS
- Drive next-generation high-performance compute (HPC) package and system architectures for client compute and datacenter platforms
- Own the end-to-end package design strategy — from concept through production
- Build a world-class team that delivers differentiated solutions leveraging advanced 2.5D and 3D integration technologies
- Partner closely with silicon design, platform architecture, and manufacturing teams to define package technology roadmaps that meet aggressive performance, power, and cost targets across Qualcomm's compute portfolio
Benefits
- Competitive annual discretionary bonus program
- Opportunity for annual RSU grants
- Highly competitive benefits package
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What This Job Offers
Job Type
Full-time
Career Level
Senior
Education Level
Ph.D. or professional degree
