Semiconductor Packaging Mechanical Engineer

Intel Corporation • Hillsboro, OR

1d • Onsite

About The Position

We're looking to hire a highly motivated mechanical engineer to join Advanced Packaging Mechanical Analysis team located in Chandler AZ or Oregon. This role is focused on developing Multiphysics thermo-mechanical simulations to support design, definition, development and qualifications of advanced semiconductor packaging led by Intel Foundry. This position offers the opportunity to work at the forefront of semiconductor packaging innovation, collaborating with engineers and researchers across multiple business groups such as design, technology integration, reliability, yield and manufacturing. Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages. Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures. Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations. Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms. The ideal candidate will have to drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs. The team leverages both experimental and numerical methods across a broad range of areas, including thermal, mechanical, and fluids. The team typically uses a combination of simulations and experiments, as needed, to help solve practical engineering problems. The team frequently leverages advanced analysis methods (statistical, AI/ML) to supplement modeling and experimental approaches. The ideal candidate should exhibit the following skills or behavioral traits: Demonstrated ability to work seamlessly between experiments and simulations. Note: This role requires regular onsite presence to fulfill essential job responsibilities.

Requirements

• Master's Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics and 2+ years of relevant experience -OR- PhD Degree in Mechanical Engineering, Chemical Engineering or Material Sciences or a related field with emphasis in solid mechanics
• Demonstrated ability to work seamlessly between experiments and simulations.
• This role requires regular onsite presence to fulfill essential job responsibilities.

Nice To Haves

• Experience with multi-physics simulations, including coupled electro-thermal-mechanical analysis, free surface two phase flows, electroplating and plasma.
• Experience with co-packaging optics, optical coupling, fiber pigtail attachment, free space optics.
• Experience with designing, planning and executing experiments, along with interpretation of results.
• Experience with scripting and automation (e.g., Python, TCL, MATLAB) to streamline simulation workflows.
• Strong understanding of advanced packaging technologies, familiarity with semiconductor packaging processes, including die attach, underfill, molding, bumping, surface mount and reflow.
• Programming/script development with artificial intelligence and machine learning concepts.
• Previous related work experience in a semiconductor foundry preferred

Responsibilities

• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of advanced semiconductor packages.
• Perform simulations to evaluate stress, strain, warpage, delamination, thermal cycling, and reliability risks across a wide range of package architectures.
• Collaborate with cross-functional teams to define simulation requirements, interpret results, and provide actionable design and process recommendations.
• Design and coordinate lab tests and research on basic materials and properties to understand material behavior and reliability failure mechanisms.
• Drive strategic development activities and work closely with internal and external customer organizations to plan, execute and communicate development activities and programs.

Benefits

• We offer a total compensation package that ranks among the best in the industry. It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Job Type: Full-time
• Career Level: Entry Level
• Number of Employees: 5,001-10,000 employees