Semiconductor Packaging Engineering PHD Intern

Intel Corporation • Chandler, AZ

1d • Onsite

About The Position

Join Intel as a Manufacturing Engineering Graduate Intern and contribute to shaping the future of semiconductor manufacturing. In this role, you will play an integral part in optimizing engineering processes and enhancing factory operations. Working alongside engineering and operations teams, you will help evaluate equipment performance, implement corrective actions, and support process improvements that drive production efficiency and elevate product quality. This internship offers hands-on experience and project-based learning opportunities that align with Intel's mission to push the boundaries of innovation. Explore your potential while gaining valuable skills and contributing to impactful business initiatives in a collaborative and dynamic environment.

Requirements

• Pursuing a PhD in Mechanical Engineering, Chemical Engineering, Materials Science with a focus on molecular dynamics in liquid-gas two-phase systems.
• 4+ years demonstrating strong familiarity with AI/ML techniques for engineering applications including Physics Informed Neural Networks and surrogate models.
• 4+ years demonstrating active research and deep understanding in Molecular Dynamics Field related to interfacial mass transport in two phase flow systems, kinetic theory and phase change modeling.
• 4+ years in strong problem-solving skills with the ability to analyze and address engineering challenges related to scaling physics from molecular scale to continuum scale for liquid-gas two phase systems.
• 4+ years of experience in modeling Molecular Dynamics in nanoconfined spaces utilizing parallel computation with software like LAMMPS, Gromacs, NAMD or OpenMM.
• 4+ years of experience in modeling large scale two phase flows with CFD/FEM software like Ansys/Fluent, OpenFOAM or Flow3D.

Nice To Haves

• Proficiency in Design of Experiments (DOE) principles.
• Experience in modeling or analyzing semiconductor packaging, including thermal and mechanical simulations.
• Excellent communication, collaboration, and organizational skills gained through internships, research projects, or coursework.

Responsibilities

• Assist in the design and optimization of manufacturing engineering processes and factory operations.
• Evaluate equipment performance and collaborate on corrective actions to address operational inefficiencies.
• Support process improvements and enhancements to boost production efficiency and product quality.
• Develop and validate finite element analysis (FEA) models to simulate thermal and mechanical behavior of semiconductor packages.
• Conduct simulations to assess factors such as stress, strain, warpage, delamination, thermal cycling, and reliability risks across diverse package architectures.
• Leverage experimental and numerical methods, including thermal, mechanical, and fluid analysis, to solve practical engineering challenges.
• Apply advanced analysis methods (statistical models, AI/ML techniques) to complement simulations and experimental approaches.

Benefits

• Our total rewards package goes above and beyond just a paycheck.
• Whether you're looking to build your career, improve your health, or protect your wealth, we offer generous benefits to help you achieve your goals.
• Go to Intel Benefits ' Intel Careers for details of benefits available to you.
• Intel reserves the right to modify, change or discontinue benefit plans at any time in its sole discretion.
• We offer a total compensation package that ranks among the best in the industry.
• It consists of competitive pay, stock bonuses, and benefit programs which include health, retirement, and vacation.
• Find out more about the benefits of working at Intel.

What This Job Offers

• Career Level: Intern
• Education Level: Ph.D. or professional degree
• Number of Employees: 5,001-10,000 employees