As a Packaging Engineer at Atomic Semi, you’ll work with a full-stack team to develop a complete process for fabricating semiconductor packaging devices. You’ll be working on things like process development, recipe creation, lithography, deposition, die attaching, bonding, etc. We are seeking an experienced Semiconductor Packaging Engineer with deep expertise in packaging methods and a passion for exploring new technologies. This person will play a critical role in developing and optimizing processes that leverage 3D printing to create innovative packaging solutions, ensuring they meet performance, reliability, and manufacturability requirements. The ideal candidate will have a broad skill set and be open-minded about integrating 3D printing into semiconductor packaging.
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Job Type
Full-time
Career Level
Mid Level
Education Level
Master's degree
Number of Employees
1-10 employees