Semiconductor Manufacturing Tech 2

MACOM Technology Solutions Holdings, Inc.•Lowell, MA

3d•$17 - $28

About The Position

MACOM designs and manufactures semiconductor products for Data Center, Telecommunication and Industrial and Defense applications. Headquartered in Lowell, Massachusetts, MACOM has design centers and sales offices throughout North America, Europe and Asia. MACOM is certified to the ISO9001 international quality standard and ISO14001 environmental management standard. MACOM has more than 75 years of application expertise with multiple design centers, Si, GaAs and InP fabrication, manufacturing, assembly and test, and operational facilities throughout North America, Europe, and Asia. Click here to view our facilities. In addition, MACOM offers foundry services that represent a key core competency within our business. MACOM sells and distributes products globally via a sales channel comprised of a direct field sales force, authorized sales representatives and leading industry distributors. Our sales team is trained across all of our products to give our customers insights into our entire portfolio. Semiconductor Manufacturing Tech 2 MACOM is seeking a self-motivated and enthusiastic semiconductor manufacturing operator/tech for our Wafer Fab. The operator/tech will report into the manufacturing team and perform general manufacturing duties on the production floor such as fabrication (lithography, etch, metals, diffusion, implant, grind/polish, glassing, dicing or wafer electrical test).

Requirements

Must have high school diploma or equivalent and at least 2 years prior manufacturing experience in semiconductor wafer fabrication or test or equivalent.
Minimum 3+ years prior manufacturing experience in semiconductor package assembly and test
Proficient with Eyelit WIP tracking system, Agile document control systems, and other business tools
Good communication skills, both written and oral; ability to read and write effectively.
Familiarity with cleanroom protocols, semiconductor wafer handling, and SPC.
Required to wear a cleanroom smock and proper safety personal protective equipment.
Flexibility to work on a day shift or evening shift schedule and support overtime as required.
Must be driven to produce quality results
Must be able to follow detailed procedures and instructions
Must have the ability and willingness to multitask and work as part of a team
Must be able to stand/walk at least 70% of the time during any one shift
Comfortable working around and with chemicals while wearing the required personal protective equipment (PPE).
Must be fluent in English, written & verbal.
Due to ITAR regulations, only candidates who are U.S. Persons (U.S. citizens, U.S. nationals, lawful permanent residents, or individuals granted asylum or refugee status) will be considered for this position.

Responsibilities

Use of both high power and low power microscopes.
Use of microscope camera for capturing images of visual defect issues.
Tweezer skills for poking very small die from tape and mounting die to various substrates.
Using MECH-EL Hot Gas Die Bonder.
Wire bonding 1 mil gold wire or ¼ x 3 gold ribbon to various package types, using West Bond 74763.
Wire attach strength pull testing using Royce 610.
Die shear testing using Dage 4000+.
Electrical testing for: Rs, TL, TRR, Theta, IR and Vf, Rp and Q.
Familiar with test equipment: HP 4280A, HP 4291B and O scope.
Visual inspection of semiconductor products of various types using MIL-STD-883 meth 2010.
Good organizational and record keeping skills.
Work on Monday-Friday 2nd shift (5x8 hour).