About The Position

As a Die Fab Operator at Nokia, you will play a pivotal role in our cutting-edge cleanroom team, focused on processing optoelectronic devices. You'll work closely with engineers and management to ensure the quality and efficiency of semiconductor wafers and Photonic Integrated Circuits (PICs). Your day-to-day responsibilities will involve meticulous inspection of materials, precision cleaving of wafers, and operating advanced evaporation tools to apply antireflective coatings. In our dynamic, collaborative environment, you'll contribute to groundbreaking technology while adhering to strict safety and cleanliness protocols. With each task, you'll have the opportunity to make an immediate impact on product quality and innovation. The culture values proactive communication, allowing you to share insights and unexpected findings with your team. You'll be integral to our mission of delivering high-quality optoelectronic solutions that shape the future of connectivity.

Responsibilities

  • Meticulous inspection of materials
  • Precision cleaving of wafers
  • Operating advanced evaporation tools to apply antireflective coatings
  • Ensuring quality and efficiency of semiconductor wafers and Photonic Integrated Circuits (PICs)
  • Adhering to strict safety and cleanliness protocols
  • Proactive communication with team members to share insights and findings
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