RF Package Design Engineer, Senior Staff

Qualcomm • Austin, TX

1d

About The Position

This position is a senior leadership role responsible for leading RF Package Design, focusing on Electrical Characterization of RF Packages in collaboration with RF design leads. The role involves RF-IC Package and system-in-package development for 6G Infrastructure and 6G consumer devices, including mobile phones. Key responsibilities include defining the packaging roadmap, projecting resource needs, and overseeing design while advancing RF packaging roadmaps and developing the company's technical capabilities. The successful candidate will possess a thorough understanding of RF package design and RF circuit design, with the ability to formulate plans from ambiguous project definitions. This role requires interaction with cross-functional teams such as RF-IC, PCB, RF-EM, System, and Process Technology Development. Additionally, the candidate is expected to manage, train, hire, and mentor junior engineers, and work across multiple geographies.

Requirements

• Master's degree in Science, Engineering, or related field
• 10+ years of RF Package/PCB design experience
• Solid understanding and experience in Electromagnetics, Transmission line theory & Crosstalk
• Proficiency in field solvers such as Ansys HFSS, Q3D and PSI
• Proficiency in simulation tools such as ADS and Hspice
• Good knowledge in design tool such as Cadence Allegro/APD/Sip or Mentor Xpedition

Nice To Haves

• Ability to optimize RF design & analysis flow and being able to automate it
• Thorough understanding of Packaging technologies and industry landscape in RF Packaging
• Familiarity with Analog & RF-IC design
• Proficiency in MatLab
• Experience in programming language(c/c++) or scripting language (Perl/Python) is a plus
• People Management experience is a plus

Responsibilities

• Working with Package designer & various RF-IC block owners (Tx, Rx, LO, PLL, ADC/DAC, etc.) to discuss bump/ball assignments, perform early analysis and discuss trade-offs to optimize the design.
• Establish BKM how to extract 3D parasitic models for various RF packages in ANSYS Electronic Desk Suite (HFSS/3D Layout/Q3D/SIWave).
• Guide team how to troubleshoot various RF problems (DC convergence, leakage, and isolation) efficiently in testbench.
• Further define methodologies for RF simulations for various Package type, frequency band and IP requirements.
• Work with Advanced Technology team to develop more robust future RF PKG technology.
• Update the design & analysis flow and automate the process.
• Create technical documentation and presentations.
• Recruit and lead team of engineers. Provide technical mentoring to junior team members.

Benefits

• competitive annual discretionary bonus program
• opportunity for annual RSU grants
• highly competitive benefits package designed to support your success at work, at home, and at play

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Number of Employees: 5,001-10,000 employees