R&D Associate, Power Electronics Packaging

The Vehicle Power Electronics Research Group in the Buildings and Transportation Science Division at the Oak Ridge National Laboratory (ORNL) is seeking a highly motivated researcher specializing in Power Electronics Packaging. ORNL, a U.S. Department of Energy (DOE) Office of Science national laboratory, has a rich 80-year history dedicated to addressing the nation's most pressing challenges. With a workforce of over 6,000, ORNL is committed to fostering a diverse, equitable, inclusive, and accessible (DEIA) environment, which is essential for achieving its mission of accelerating scientific discoveries and translating them into solutions for energy, environment, and security issues. The selected researcher will focus on conducting research related to wide bandgap power electronic modules and power sub-systems, addressing performance, reliability, and cost challenges at both the packaging design and system levels. This role involves developing innovative packaging technologies to push the boundaries of power electronics packaging for advanced applications. The researcher will be responsible for determining research needs and specifications for power electronics packaging, performing design work, and researching new advanced packaging technologies such as sintering, welding, wire bonding, and interconnect systems. Additionally, the researcher will utilize 3D multiphysics models for optimizing electrical, mechanical, thermal, and magnetic aspects of next-generation power modules. The role includes conducting R&D projects, expanding R&D capabilities, and collaborating with various internal and external groups, including industry partners and funding agencies. The researcher will also prepare proposals, present research findings, and contribute to ORNL's mission by aligning with core values of Impact, Integrity, Teamwork, Safety, and Service, while promoting a respectful workplace that values diversity and inclusion.