Project Engineer IV, Electronics Packaging

Lockheed MartinHighlands Ranch, CO
1dOnsite

About The Position

Join us as a Project Engineer within our Electronics Packaging department, you will be responsible for the successful execution of Central Electronics Packaging commitments to customers. Location: This position does not support teleworking ; the selected candidate will be located near our Lockheed Martin Space facility in: Highlands Ranch CO You will be working a flexible 9x80 schedule in the office full-time. Space is a critical domain, connecting our technologies, our security, and our humanity. While others view space as a destination, we see it as a realm of possibilities, where we can do more — we can innovate, invest, inspire, and integrate our capabilities to transform the future. At Lockheed Martin Space, we aim to harness the full potential of space to cultivate innovation, reduce costs, and push the boundaries of what technology can achieve. We’re creating future-ready solutions, focusing on resiliency and urgency through our 21st Century Security® vision. We’re erasing boundaries and forming partnerships across industries and around the world. We’re advancing spacecraft and the workforce to fuel the next generation. And we’re reimagining how space can connect us, ensuring security and prosperity. Join us in shaping a new era in space and find a career that's built for you.

Requirements

  • 5+ years of professional experience for this role.
  • You will need to obtain and maintain a DoD Secret clearance , thus US Citizenship is required.
  • Bachelor's degree or higher from an accredited college in Mechanical Engineering, Electrical Engineering or related discipline, or equivalent experience/combined education.
  • Prior relevant project management experience.
  • Proficient in the usage of Microsoft Office applications (Powerpoint, Excel, Word, Project).
  • Ability to obtain and maintain a Secret clearance

Nice To Haves

  • Knowledge of the electronics design/development, manufacturing, and test process for high-reliability applications.
  • Knowledge of the manufacturing flow for electronics (PWB, CCA, enclosures).
  • Earned Value Management (EVM) and/or Control.
  • Account Management (CAM) experience.
  • Knowledge of Commercial and Government contracting practices in an Aerospace environment.
  • RF/Avionics Packaging design and manufacturing experience.
  • Previous experience project managing a red program.
  • Previous experience using Open Plan.
  • Proficient in the usage of LM Engineering Tools (SAP, VECAMs, EPDM.
  • Active DOD Secret Clearance.

Responsibilities

  • Execution accountability for electronics packaging tasks across a portfolio of customer areas including Commercial, Civil, Military, and classified.
  • Planning and oversight of assigned design efforts (to include SLA [Service Level Agreement] creation and management)
  • Ownership and execution of Electronics Packaging special projects related to process improvement, standardization, OneLM Culture initiatives, etc.
  • Scope of activities include all business phases: Capture, development, recurring support, producibility improvements, troubleshooting and on-orbit support.
  • Manufacturing support responsibilities.
  • Chairing weekly team meetings to discuss technical issues, schedule issues, etc.
  • Weekly status chart package and reporting to programs/management.
  • You need to be willing to work flexible hours to accommodate program priorities.

Benefits

  • Medical, Dental, Vision, Life Insurance, Short-Term Disability, Long-Term Disability, 401(k) match, Flexible Spending Accounts, EAP, Education Assistance, Parental Leave, Paid time off, and Holidays.
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