TTM Technologies, Inc. is a leading global manufacturer of technology products, including mission systems, radio frequency (“RF”) components, RF microwave/microelectronic assemblies, and technologically advanced printed circuit boards (“PCB”s). TTM stands for time-to-market, representing how TTM's time-critical, one-stop design, engineering and manufacturing services enable customers to reduce the time required to develop new products and bring them to market. Additional information can be found at www.ttm.com Scope: The Bonding Operator is responsible for performing all duties related to loading/unloading presses according to work instructions and production needs. Duties and Responsibilities: Run press set-up, operation, shutdown, and emergency shutdown Verify cycle pressures and temperature by job/work instructions Load and unload presses After the lamination process is complete, breakdown books Perform cleaning of plates, pins, and other department equipment Operate routing machine to take off excess resin after the lamination process Take necessary measurements Operate calipers Follow all departmental process procedures correctly Complete all departmental documentation accurately Complete quality checks when product arrives in and exits the department Perform other tasks as assigned by management and cross-train as needed to assist production Note: The statements herein are intended to describe the general nature and level of work being performed by employees, and are not to be construed as an exhaustive list of responsibilities, duties, and skills required of personnel. Furthermore, they do not establish a contract for employment and are subject to change at the discretion of the employer.
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Job Type
Full-time
Career Level
Entry Level
Education Level
High school or GED