Product Engineering Fall Intern 2025

* Collaboration with cross functional teams to familiarize with different IC packaging technologies and product lines ranging from Analog/Mixed Signal devices to Image Sensor products. * Maintain weekly log of activities and provide weekly reports of learnings/next steps. * Understand differences in package types and advantages/disadvantages of each one. * Grasp an understanding of the evolution of package types and designs base on manufacturability, costs, market demands, technology and application advancements. * Work on consolidating IC packaging database for Image Sensor Group (ISG) products. * Work with Test groups to understand test requirements of products and methodologies including required metrics. * Work with Rel team to learn IC packaging reliability test conditions, purpose of each test and different type of Rel test requirements base on industry (Automotive, Industrial, Aerospace…etc).