Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. Develop next-generation High Bandwidth Memory (HBM) products that target the automotive market where the combination of high performance, extended temperature ranges, and very low system-level DPM requirements will present an array of engineering and manufacturing challenges. Work as a key interface between Design, Manufacturing, Test, and Quality internal departments as well as external customers. Take ownership of HBM products starting at the Design phase, through initial bring-up, qualification, and into volume production. Innovate and integrate end-to-end groundbreaking front-end and backend processes with groundbreaking design, debugging various tests, and qualification techniques to develop the lowest power per bit solutions to improve customer experience in the fields of ML (Machine Learning), AI (Artificial Intelligence), ADAS (Advanced Driver-Assistance System), and autonomous vehicles. Understand the JEDEC specifications for HBM and the additional requirements that the automotive market brings. Validate HBM designs and tackle automotive-specific problems through hardware and software debugging in the lab, circuit simulations, and data analysis. Communicate and collaborate with PE team as well as other multi-functional teams. May telecommute part-time. Employer will accept a Master’s degree in Electrical Engineering, Computer Engineering, or related field.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees