Process Integration Engineer
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About The Position
This engineering opportunity requires working within a multidisciplinary team. The candidate should feel enthusiastic about working in a class 10 cleanroom or similar lab environment daily for 80% of the time. The individual will be responsible for implementation and/or overseeing various wafer microfabrication processing steps. This includes preparing detailed and accurate work flow instruction as well as performing various levels of inspection. In addition, they will be required to learn and operate a state-of-the-art precision die bonder in a proficient manner. They will be expected to acquire sufficient understanding for executing fine-alignment D2D or D2W bonding with high yield within a 2-3 month period.
