The position involves working at the Applied Materials META Center in Albany, NY, focusing on advanced semiconductor technologies. The role requires expertise in wafer bonding, heterogeneous wafer level packaging, and other complex processes to integrate devices on silicon wafers. The candidate will collaborate with various stakeholders to meet project deadlines and solve complex engineering problems, contributing to the development of back-end-of-line (BEOL) processes and wafer level packaging.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Mid Level
Industry
Computer and Electronic Product Manufacturing
Education Level
Bachelor's degree