PID - Process Integration Engineer (P3)

TSMCPhoenix, AZ
Onsite

About The Position

TSMC Arizona is operating on leading edge semiconductor process technology. TSMC Arizona’s first fab started operations in Q4’2024 on N5 and N4 process technology. Its second fab will operate N3 process technology and is on track for volume production start in 2H 2027. The third fab will run N2 and more advanced technology, and will be in production by 2030. Plans have been announced to build an additional three semiconductor fabs and two advanced packaging facilities. America's leading technology companies are relying on TSMC Arizona for the next generation of chips that will power the digital and AI future. TSMC Arizona is seeking a Process Integration Engineer (PIE) for a pivotal role dedicated to ensuring customers achieve success throughout the full lifecycle of their products. This includes New Product Introduction (NPI), device performance, yield, and reliability, leveraging our most advanced technology. Engage your passion for semiconductors and engineering by utilizing cutting-edge, agile, and intelligent operating systems to drive manufacturing excellence. Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or specific requests. Your contributions will be instrumental in achieving exceptional outcomes for our customers.

Requirements

  • Applicants must be legally eligible to work in the United States and have:
  • Bachelor, Master or Ph.D. degree in Electrical Engineering, Material Science or Physics.
  • Experience in leading the improvement of the silicon process flow Including front-end-of-line (FEOL), middle-end-of-line (MEOL), and back-end-of-line (BEOL)
  • Experience with process shifts, changes with design rules and product layout with individual process steps and their impact on Function Yield, Electrical Test and Product Performance as well as short- and long-term reliability implications.
  • Good communication and interpersonal skills.
  • Able to work on cross-functional and geographically dispersed teams with diverse backgrounds.
  • A team player that can multitask and thrive in a very dynamic and fast-paced environment.

Responsibilities

  • New product qualification and technology transfers from a mother fab.
  • Big data analysis to identify process design weaknesses and/or manufacturing tool issues.
  • Designing, executing, and analyzing experiments to improve yield and performance for each specific product.
  • Collaborating with the engineering teams to maintain process stability and provide technical solutions to customers.
  • Scheduled night shifts and weekend on-call rotations in a 24/7 high-volume manufacturing environment.
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