TSMC Arizona is operating on leading edge semiconductor process technology. TSMC Arizona’s first fab started operations in Q4’2024 on N5 and N4 process technology. Its second fab will operate N3 process technology and is on track for volume production start in 2H 2027. The third fab will run N2 and more advanced technology, and will be in production by 2030. Plans have been announced to build an additional three semiconductor fabs and two advanced packaging facilities. America's leading technology companies are relying on TSMC Arizona for the next generation of chips that will power the digital and AI future. TSMC Arizona is seeking a Process Integration Engineer (PIE) for a pivotal role dedicated to ensuring customers achieve success throughout the full lifecycle of their products. This includes New Product Introduction (NPI), device performance, yield, and reliability, leveraging our most advanced technology. Engage your passion for semiconductors and engineering by utilizing cutting-edge, agile, and intelligent operating systems to drive manufacturing excellence. Collaborate with fellow innovators across device, product engineering, lithography, etch, and thin films process teams to identify integrated process solutions that address customer issues or specific requests. Your contributions will be instrumental in achieving exceptional outcomes for our customers.
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Job Type
Full-time
Career Level
Entry Level