Applied Materials is a global leader in materials engineering solutions used to produce virtually every new chip and advanced display in the world. We design, build and service cutting-edge equipment that helps our customers manufacture display and semiconductor chips – the brains of devices we use every day. As the foundation of the global electronics industry, Applied enables the exciting technologies that literally connect our world – like AI and IoT. If you want to push the boundaries of materials science and engineering to create next generation technology, join us to deliver material innovation that changes the world. Applied Materials’ Integrated Materials Solution Group is searching for an intern to join our team in January 2026 for 6+ months. Our group explores and builds novel devices in the ICAPS (Internet of Things, Communications, Automotive, Power and Sensors) and Advanced wafer level heterogeneous integration technology sectors. Our opportunity will give you hands-on experience in semiconductor and advanced packaging process environments, and help you establish an understanding of the relationships between device design, material physics, process development, technology integration and functional characterization. The position will entail the following: Assist with fabrication of proof-of-concept devices, which may include one or more of the following: device layout, wafer processing, metrology and characterization, physical and electrical data analysis, and documentation. Lead small development projects involving wafer metrology, material characterization and data analysis Support process integration engineering through procurement, shipping, and inventory functions Immediate opening, start date in January 2026 for 6+ months. Onsite in Cambridge, MA.
Stand Out From the Crowd
Upload your resume and get instant feedback on how well it matches this job.
Job Type
Full-time
Career Level
Intern