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Join a team that develops next-gen products in the field of micro-electrical and micro-optical mechanical systems (MEMS and MOEMs) for Honeywell Aerospace's Advanced Technology division. Work with highly skilled engineers and technicians in a state-of-the-art process lab developing and characterizing new sensors for aerospace applications. Contribute to business growth by proposing new research ideas and exploring innovative process techniques. The ideal candidate will have a broad understanding of materials and fabrication on silicon wafers, will effectively be able to lead a team of process lab technicians, and will have intimate knowledge of the workings of the machinery which comprise a process lab. You will develop new products and processes in support of the organization's business strategies in cutting-edge technology development. Use wafer fabrication experience and skills for new business opportunities, products and processes in an R&D environment. Areas of concentration will include process integration and metrology techniques specific to micromachining such as e-beam lithography, LPCVD, photolithography, DRIE, ICP etching, PECVD, wafer bonding, lithography, ALD, electroplating, CVD & PVD techniques, profilometry, ellipsometry, SEM, and others.
