Applied Materials-posted 2 days ago
$147,000 - $202,500/Yr
Full-time • Mid Level
Santa Clara, CA

As a Process Engineer, you'll play a crucial role in designing and optimizing manufacturing processes for display and semiconductor manufacturing technologies. You will collect and analyze data, perform hardware characterization, and troubleshoot engineering issues. You'll also measure film properties, generate technical documentation, and engage with customers to resolve concerns. Process Engineers collaborate with vendors and suppliers, and become familiar with implementing new technologies and products. You will experiment, learn, and collaborate with some of the brightest minds in the semiconductor and display industries, partnering with our globally recognized R&D teams on state-of-the-art research and development projects. We are seeking a highly skilled Process Engineer with deep experience in photonics and advanced packaging technologies to support the development of high-performance photonic interconnects and co-packaged optical systems. This role is critical for enabling high-density, low-loss interconnects in next-generation computing, sensing, and communication platforms.

  • Design and develop advanced packaging architectures for microLED photonic interconnects and heterogeneous integration.
  • Lead Cu backplane RDL design, layout, fabrication, and integration.
  • Develop mass transfer and die bonding solutions, including thermal compression bonding and hybrid bonding, tailored to system integration requirements.
  • Collaborate with substrate layout, IC design, and module teams to co-optimize packaging, signal integrity, and thermal performance.
  • Perform thermal, mechanical, and optical simulations to validate packaging reliability and performance.
  • Conduct optical, electrical, and tolerance analysis of photonic devices; optimize components for performance, efficiency, reliability, and manufacturability.
  • Ph.D. in EE, MSE, Phys, or related discipline (M.S. with relevant experience may be considered).
  • Proven experience in Cu RDL layout, design, fabrication, and integration.
  • Hands-on expertise in thermal compression bonding and hybrid bonding processes.
  • Experience with Co-Packaged Optics (CPO) and Optical Engine development.
  • Experience working in cleanroom environments and advanced IC fabrication.
  • Proficiency in design layout and simulation software such as Cadence (APD/SIP), AutoCAD, SolidWorks, KLayout, COMSOL and Ansys.
  • Strong problem-solving skills and ability to work in a collaborative research environment.
  • You’ll benefit from a supportive work culture that encourages you to learn, develop, and grow your career as you take on challenges and drive innovative solutions for our customers.
  • We empower our team to push the boundaries of what is possible—while learning every day in a supportive leading global company.
  • At Applied Materials, we care about the health and wellbeing of our employees. We’re committed to providing programs and support that encourage personal and professional growth and care for you at work, at home, or wherever you may go.
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