Process Engineer

QCi•Tempe, AZ

20d

About The Position

This position is responsible for overseeing the photolithography and/or wet process development, continuous improvement, and sustainability of a 150 mm wafer line based on QCi’s thin film lithium niobate (TELN) technology. The successful candidate will work in close collaboration with process development, yield enhancement, and equipment engineering team members in charge of high-volume manufacturable processes for our TFLN products. The candidate will be accountable for robust processes supporting QCi’s top level manufacturing metrics such as safety, quality, cost, and delivery goals as it relates to their role.

Requirements

Bachelor’s, Master’s, or Ph.D. in Materials Science, Electrical Engineering, Physics, or related field.
5+ years of experience in semiconductor process engineering, specializing in photolithography (ASML, clean track) and/or wet (single wafer clean/etch, batch clean/etch) processes.
Strong background in wet chemistry and/or DUV stepper lithography for III-V semiconductor processing.
Expertise in GaAs and InP processing, including device fabrication challenges and best practices.
Hands-on experience with metrology tools such as CD SEM, Alignment, Film Thickness Characterization, Particle Measure for process verification and defect analysis.
Strong problem-solving skills with experience in data analysis, SPC, and DOE.
Ability to work in a cleanroom environment and interface with cross-functional engineering teams.
Translate PFMEA outputs into actionable process controls, ensuring proactive prevention of variation rather than reactive correction.
Define and implement the inspection methods, calibration systems, and SOPs.
Deploy advanced sampling strategies, SPC controls, Cp/Cpk, GR&R, and integrate Minitab/JMP analytics into daily operations.

Nice To Haves

10+ years’ experience in Photolithography and/or Wet Process development, process integration
Experience and understanding of microfabrication for photonics devices, process integration, photonic materials properties and modification, and the incorporation of MEMS and electronic devices. Specific knowledge of lithography, etching, deposition, sputtering, and associated processing is highly valued.
Apply large-scale data analytics to Track-and-Trace datasets, enabling predictive insights and real-time defect containment.
Experience with heterogeneous bonding between wafers and chips is valued.
Experience working with 5S, and 6 Sigma

Responsibilities

Lead the development and optimization of photolithography and/or wet processes for compound semiconductor applications.
Drive process integration and improvement initiatives to enhance device performance and yield.
Work closely with the process team in the cleanroom to optimize associated metrology measurements in the fabrication flow of TFLN chips
Facilitate the transition of research level chip scale production, to low, to middle volume manufacture at wafer scale
Utilize advanced metrology tools such as CD SEM, AFM, ellipsometry, profilometry, XPS, XRD, and optical interferometry for process characterization and defect analysis.
Work closely with integration, production, and device engineering teams to integrate photo and/or wet processes into the overall semiconductor fabrication flow.
Troubleshoot process deviations, particle contamination, and unit performance issues, implementing corrective actions and continuous improvement strategies.
Establish and maintain SPC for process monitoring and optimization.
Evaluate and qualify new photo and/or wet chemistries, masks, hardware configurations, and process automation tools.
Develop and document process recipes, work instructions, and standard operating procedures (SOPs).
Mentor junior engineers and provide /or leadership in semiconductor photo, wet, mask, and associated metrology.