The Advanced Electronics and Photonics Core Facility seeks a qualified candidate for a process engineer senior position. The candidate will mainly be focused on photolithography and wet etching; these areas include spin coating, maskless aligning, developing wet photoresist removal, descum, and wet etching using both liquid and dry film photoresists. Primary areas of responsibility will include process development on our forthcoming 300mm wafer packaging toolsets as well as equipment ownership of selected tools. As part of a multi-disciplinary team, you will interact with individuals responsible for areas such as device physics, deposition, etching, panelization, and electrical test to ensure robust wafer packaging processes that meet the precise physical and electrical requirements for our customers. As part of the AEP Core operations team, you will help to maintain the wafer prep and finishing process areas by supporting operations and increasing equipment up time, responding to production issues, implementing solutions, reducing costs, and improving yields. In this position, you will support existing processes, develop new processes, identify process and material improvements, and develop intellectual property. You will also use statistical process controls and data analysis to support and monitor the performance of the equipment. Customer service is an integral part of the process engineer senior position. The candidate will be interacting directly with a wide variety of students, faculty, and other professionals to provide services as requested. Skill in communicating technical ideas in a positive and patient manner is a must. This position may be subject to additional screening in the hiring process.
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Job Type
Full-time
Career Level
Mid Level
Number of Employees
5,001-10,000 employees