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The Advanced Electronics and Photonics Core Facility seeks a qualified candidate for a senior process engineering position. The candidate will mainly be focused on electroplating processing and will be expected to assist or provide backup to other areas. Primary areas of responsibility will include electroplating process development on our forthcoming 300mm wafer plating system as well as ownership of associated chemical metrology systems. As part of a multi-disciplinary team, you will interact with individuals responsible for areas such as device physics, deposition, etching, photolithography, and electrical test to ensure robust electroplating processes that meet the precise physical and electrical requirements for our customers. As part of the AEP Core operations team, you will maintain the electroplating process area by supporting operations and increasing equipment up time, responding to production issues, implementing solutions, reducing costs, and improving yields. In this position, you will support existing processes, develop new processes, identify process and material improvements, and develop intellectual property. You will also use statistical process controls and data analysis to support and monitor the performance of the equipment. Customer service is an integral part of the senior process engineer position. The candidate will be interacting directly with a wide variety of students, faculty, and other professionals to provide services as requested. Skill in communicating technical ideas in a positive and patient manner is a must.
