Process Engineer - Packaging and Epoxy

Fujifilm•Santa Clara, CA

11d•$100,000 - $140,000

About The Position

POSITION SUMMARY: Process Development Engineer II will play key role in developing new MEMS-based inkjet printhead products and improving manufacturing capabilities in assembly operation. Develop and improve print head packaging processes and technology. Own tools and the processes run on them, minimizing yield loss and maximizing process performance. Provide production support engineering for a specific product or group of products (inkjet print heads) during transfer from design to production. Interface with other engineers to solve technical problems. Work closely with R&D and manufacturing engineering to qualify new tools and processes for volume production. Knowledge: Having wide-ranging experience, uses professional concepts and company objectives to resolve complex issues in creative and effective ways. Job Complexity: Works on problems of diverse scope where analysis of data requires evaluation of identifiable factors. Demonstrates good judgment in selecting methods and techniques for obtaining solutions. Networks with senior internal and external personnel in own area of expertise. Supervision: Normally receives little instruction on day-to-day work, general instructions on new assignments. Experience: Typically requires a minimum of 5 years of related experience with a Bachelor’s degree; or 3 years and a Master’s degree; or PhD; or equivalent experience. Company Overview At FUJIFILM Dimatix Inc., printing and material deposition devices are only as good as their printheads. We are a recognized leader in the manufacturing and design of durable and productive drop-on-demand inkjet printheads that power cutting-edge systems, as well as integrated inkjet solutions that add digital inkjet capabilities to other equipment. These are part of the digitization and transformation of many applications such as commercial printing, graphics, label & packaging, additive manufacturing, ceramic tiles, textiles, electronics and life science research. We’re looking for forward-thinkers eager to spark innovation in inkjet technology. Bring your talents to a team built on collaboration, creativity, and a passion for excellence. At FUJIFILM Dimatix, every product we make begins with the extraordinary people behind it. Join us for groundbreaking work in a flexible, engaging environment. We’re based in two incredible locations: Lebanon, New Hampshire, surrounded by picturesque New England landscapes, and Santa Clara, California, a dynamic hub in Silicon Valley with a mix of innovation, diversity, and sunshine. Fujifilm is globally headquartered in Tokyo with over 70,000 employees across four key business segments of healthcare, electronics, business innovation, and imaging. We are guided and united by our Group Purpose of “giving our world more smiles.” Visit: https://www.fujifilm.com/us/en/about/region/careers Job Description Salary range for position: $100,000 - $140,000, commensurate with experience.

Requirements

BS in Engineering, Material Science, Chemistry, or Physics
5 or more years of related experience. Experience should include process and design engineering work in a high precision assembly/manufacturing environment.
Ability to find root causes of assembly process problems.
Excellent problem identification and problem-solving skills.
Ability to learn and operate processing equipment such as: dispensers, high speed pick & place, X-ray and IR inspection systems.
Ability to apply mathematical operations for statistical analysis.
Must have excellent written, verbal and presentation skills, to effectively present information to engineers, technicians, customers, and management.

Nice To Haves

Advanced degree in Engineering, Material Science, Chemistry, or Physics.
Experience with semiconductor packaging technologies
Experience with epoxy chemistry
Experience with Datacon, wire bonders, and/or epoxy dispense systems.
Experience developing custom manufacturing tooling/fixturing for precision assembly.
Software knowledge: Solidworks Cognex VisionPro and/or Insight Programming Do-More, RSLogix and/or Wonderware

Responsibilities

Develop and improve print head assembly and packaging processes.
Set technical direction with respect to toolset and process technology including identifying and evaluating new materials, processes, and equipment.
Use good problem solving and project management skills to solve a wide array of technical product problems.
Manage the automation of current and new manufacturing processes, including tooling and fixture design, process development and build.
Employ an extensive technical knowledge of more than one area of engineering (design, controls, systems, project) in complex process characterization, optimization, scale-up or manufacturing support projects.
Communicate especially well and motivate others outside and inside the department to resolve problems and accomplish work through various company resources.
Organize technical problem solving strategies clearly and present them effectively to all concerned parties.
Drive use of problem solving methodologies (e.g. FMEA, SPC, Control Plans, QFD and Design of Experiments) to help resolve or correct identified problems.
Facilitate problem solving and brainstorming activities, and participates in and supports cross-functional teams.