Process Engineer I

Tel Technology Center America • Albany, NY

288d • $65,999 - $93,299

About The Position

The brightest of the bright. Our scientists at TEL Technology Center, America, LLC, work to integrate new and innovative technology into the products and tools we currently have as well as develop new tools to streamline our current processes. We are a representation of TEL's world class technology enabling us to move to the forefront of today's marketplace. Utilizing original development strategies and processes has fully equipped us with the capability to provide unparalleled service systems that have been utilized on a global scale. Group/Role Overview: The 3DI Process Technology Group at TTCA focuses on Heterogenous Integration and key module developments in the area including but not limit to Fusion and Hybrid Bonding in both wafer to wafer (W2W) level and chip to wafer (C2W) level, Wafer Thinning and TSV formation and for use in semiconductor manufacturing. We optimize the processes and hardware used to stack integrated circuits for advanced 3D applications including CMOS image sensors, memory devices, and logics. The HI Process Engineer will be an integral part group working on advanced wafer and die stacking technologies. This individual will provide process engineering support to ongoing development, in addition to identifying and developing novel processes in this rapidly evolving semiconductor space. We have an opening for a heterogeneous integration process engineer with expertise in advanced packaging and wafer bonding. You will work with process development and process fundamental study to define next generation heterogeneous integration process and equipment design concept in cross-functional and cross-continental working environments.

Requirements

• BS Degree in Nanotechnology, Material Science, Mechanical, Chemical, or Electrical Engineering, Chemistry, Physics (advanced degree in Packaging preferred)
• Knowledge and experience on advanced packaging
• Hands on experience with semiconductor processes (experience in 3DI processes such as bonding, TSV formation and filling, wafer thinning, 3DI metrology including bond energy, AFM, CSAM, etc., would be preferred)
• Experience in writing technical specifications and statements of work
• Communication and team skills
• Must be fluent in English with excellent verbal and written communication skills
• Must be able to work in teams as well as individually
• Must possess the ability and desire to work as a part of a multicultural team

Responsibilities

• Be an integral part of the 3DI team and work on evaluating and improving the HVM bonding equipment in both W2W and C2W
• Ensure that all 3D process tools are operational and in spec
• Create and revise standard operating procedures as needed
• Document tasks and results for future reference
• Develop or identify new or modified processes necessary for high bond quality and scaling of hybrid bond interconnects
• Assist in recommendation and interpretation of physical and chemical behaviors as part of process characterization
• Work with group engineers to propose criteria and format for hardware and process evaluations
• Compile and analyze process data from the evaluations to determine appropriate limits and variables for process or material specifications
• Own and drive specific projects within the 3D projects, based on experience and interests
• Deliver the goals as a part of cross-functional and cross-continental working teams and/or JDP with other companies

Benefits

• Comprehensive benefits package
• Educational reimbursement to help you achieve your learning goals
• Eligibility in bonus plan and long-term incentives for certain roles

What This Job Offers

• Career Level: Entry Level
• Industry: Machinery Manufacturing
• Education Level: Bachelor's degree