WORK STYLE DESIGNATION: Onsite / Hybrid (+50% Remote) WORK STYLE REQUIREMENT: Onsite - 80% / Remote - 20% WORK LOCATION: NCP (Hillsboro, OR) Office EXPECTED PAY RANGE : $64,811.80 - $146,963.71 Annually This pay range is for the position's base salary only. This position may be eligible for other compensation including incentive pay and/or allowances. Candidates will receive additional information during the interview and selection process. PRIMARY RESPONSIBILITIES Perform all responsibilities in a safe manner. Comply with all company policies including Environmental, Health, and Safety procedures and requirements. Protect company intellectual property and confidential information. Quickly learn, train, and upskill to latest equipment and technology. Ability to learn through on-the-job training. Establish and maintain an awareness of maintenance and lab procedures. Responsible for hands-on process engineering development, research, and evaluation support to deliver solutions that meet or exceed customer requirements for current and future technology semiconductor manufacturing processes. Work with a team on projects and development-related tasks, including data collection, analysis, and reporting to meet customer expectations. Ability to work within a matrix environment. Interface with internal customers, managers, and teammates within the organization. Hold a position-relevant understanding of the relationships between plasma principals, etch fundamentals, and hardware functionality and relates them to process/project impact. Hold a position-relevant understanding of business context, technology and industry trends, and competitor capabilities. Professionally represents the company to the customer; able to create internal and external documentation for projects and products, including presentations, technical reports, and process engineering specifications. (PE IV) Responsible for hands-on process engineering development, research, and evaluation support to deliver solutions that meet or exceed customer requirements for current and future technology semiconductor manufacturing processes. Performs project and development related tasks including data collection, analysis, and reporting. The position is expected to be able to drive multiple projects simultaneously with a high level of autonomy; ensuring that necessary support is given to meet customer expectations. (PE IV) Ability to work within a matrix environment. Acts as a resource across the department working with diverse stakeholders across multiple teams, and lead cross-team or cross group efforts involving more people. May lead small projects with manageable risks and resource requirements. (PE IV) Supports customer account and technology managers in support of product demos and other business development activities. May be expected to interface with Hitachi’s global engineering teams and their corporate R&D headquarters in Japan.
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Job Type
Full-time
Career Level
Entry Level
Number of Employees
5,001-10,000 employees