Our vision is to transform how the world uses information to enrich life for all. Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever. The Advanced Packaging Technology Development (APTD) department at Micron Technology is at the forefront of innovation, driving the advancement of memory and storage Interconnects and Packaging solutions that transform how the world uses information. Micron is dedicated to developing innovative processes and technologies that enable the creation of next-generation semiconductor products which drive the AI revolution. By collaborating closely with our global R&D, equipment and materials suppliers, and manufacturing teams, we ensure the efficient development, transfer and implementation of new technology nodes, maintaining Micron's leadership in the industry. The Thermal Simulation Engineer will be directly involved in developing new and derivative advanced memory (HBM) packaging technologies, driving Micron’s Thermal advantage by designing premier packages in the APTD team. In this position, you will be influencing the Product power maps, die and package architecture, and Si BEOL design rules, finding efficient package structure and materials to mitigate any potential hot spot issues. The scope of your work will be to address all Thermal aspects of 2.5D and 3D advanced packaging development that are related to design, material and process interactions. In this position you will collaborate with package architecture and design, fab/package assembly process integration, BU teams, and customers.