Principal Thermal Mechanical Photonic Designer

NVIDIA•Santa Clara, CA

About The Position

This role is for a Principal Thermal Mechanical Photonic Designer within NVIDIA's global circuits team, which is responsible for crafting state-of-the-art GPUs used in supercomputers, gaming consoles, and self-driving cars. The team's mission is to engineer the next generation of outstanding products, focusing on the architecture and design of CMOS and Silicon-Photonics high-speed chip interfaces (NVLink, IEEE, PCIE, USB, OIF) and other sophisticated photonic functions. The position requires strong hands-on lab experience in silicon evaluation, debugging, characterization, and bring-up.

Requirements

PhD in Electrical Engineering, Physics, or a similar discipline (or equivalent experience) with 15+ years of experience in a related field
8+ years of experience in the development of silicon photonics ICs from concept to high-volume manufacturing
Experience in product development of optics or photonic systems
Experience in applied research on Silicon Photonic ICs and Systems
Hands-on experience with Silicon Photonics products
Proficient in Ansys tools
Background with design tools and fixtures to aid in alignment, fabrication, gluing, and assembly of lasers, interferometers, and optical components
Experience working, communicating, and collaborating in a cross-functional team environment
Experience defining system performance and component specifications
Excellent verbal and written communication skills
Self-motivated and self-directed individual, with little supervision vital

Responsibilities

Work on Thermal and Structural design of Silicon Photonic designs
Run stress simulation in optical components and fiber alignment and propose improved design of optical components.
Set up experimental methodology for thermal validation and laser performance under different stress conditions.
Modeling Si die-package thermo-mechanical interactions
Solder joint fatigue and creep modeling
Support the optical engineering and system engineering leads with the opto-mechanical system design.
Die-package thermo-mechanical interactions in electronic packages for predicting failures during various assembly and reliability tests to recommend design, process or material changes.
Hygroscopic stresses in electronic packages due to moisture diffusion.
Crack propagation and interfacial delamination.
Multifaceted simulation of wire-bonding and wire fusing process
Thermal characterization of electronic packages (crafting thermal specification datasheets based on FE and experiments according to JEDEC standards)
Solder joint fatigue and creep modeling