About The Position

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems is seeking a Principal or Sr Principal Semiconductor Installation Equipment Engineer for our Advanced Technology Lab (ATL) - located in Linthicum, Maryland (near Baltimore) – where we design, manufacture, and test semiconductor products for internal and commercial production customers as well as emerging technology programs. Northrop Grumman’s ATL semiconductor foundry is a unique capability supporting a range of production microelectronic devices (Silicon, Gallium Arsenide, Gallium Nitride, Silicon Carbide, Carbon Nanotubes) and providing leading edge technology development in superconducting electronics. Our devices enable a number of Northrop Grumman’s ground-based radars, avionic radars, and space systems. Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly.

Requirements

  • Bachelor’s degree in a STEM discipline and 5 years of relevant experience; MS degree and 3 years; or PhD and 1 year experience.
  • Experience in a technical role directly working with semiconductor fabrication equipment, wafer fabrication facilities, or sustaining operations.
  • Experience with semiconductor equipment maintenance and fab facility infrastructure.
  • Demonstrated ability to work with cross organizational teams such as engineering, line maintenance, building maintenance, trades, and process engineering.
  • Excellent written and verbal communication skills.
  • US citizenship and ability to obtain and maintain a TS/SCI clearance.

Nice To Haves

  • Experience with equipment installation and tool startup.
  • Experience with Architecture and Engineering (A&E) drawing sets.
  • Proven track record managing capital projects from inception through completion, including financial, risk and schedule management.
  • Experience interfacing with vendors, trades, and engineering firms.
  • Background in controls and automation.

Responsibilities

  • Lead and manage capital tool installation projects.
  • Participate in trade studies and lead design iterations.
  • Coordinate installation activities and project closeout as it pertains to installation of semiconductor equipment.
  • Plan facilities and factory layout for foundry equipment.
  • Make engineering decisions and provide program/customer facing status updates.
  • Minimize impact to operations, trades, design teams, vendors, and internal stakeholders.
  • Develop and apply continuous improvement of existing installation business processes.
  • Align multiple installation projects with management objectives.
  • Coordinate installations across multiple process areas and equipment platforms.

Benefits

  • Health insurance coverage
  • Life and disability insurance
  • Savings plan
  • Company paid holidays
  • Paid time off (PTO) for vacation and/or personal business
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