Principal/Senior Principal Process Integration Engineer

Northrop Grumman • Linthicum Heights, MD

75d • $105,400 - $158,000

About The Position

At Northrop Grumman, our employees have incredible opportunities to work on revolutionary systems that impact people's lives around the world today, and for generations to come. Our pioneering and inventive spirit has enabled us to be at the forefront of many technological advancements in our nation's history - from the first flight across the Atlantic Ocean, to stealth bombers, to landing on the moon. We look for people who have bold new ideas, courage and a pioneering spirit to join forces to invent the future, and have fun along the way. Our culture thrives on intellectual curiosity, cognitive diversity and bringing your whole self to work — and we have an insatiable drive to do what others think is impossible. Our employees are not only part of history, they're making history. Northrop Grumman Microelectronics Center (NGMC) of Northrop Grumman Mission Systems seeks to fill a Process Integration Engineer position in the Semiconductor Technologies group with a focus on device and process development for next-generation RF technologies within our Advanced Technology Lab (ATL). ATL is located just outside of Baltimore, MD - where we design, manufacture, and test microelectronic products for internal and commercial production, as well as emerging programs. We have over 21,000 square feet of Class 100 wafer fabrication cleanroom that supports variants of Silicon, Gallium Arsenide, Gallium Nitride, and Silicon Carbide. Join us for the opportunity to work with an amazing, experienced, and talented team while helping serve your country. Enjoy the opportunity to grow and learn with a variety of challenging projects in R&D, ongoing long-term programs, and new programs targeting future military platforms. Our multidisciplinary foundry team enables activities from development to sustainment process engineering. ATL is responsible for all aspects of semiconductor technology including design, mask making, wafer fabrication, test, and assembly.

Requirements

• Bachelor's Degree in Electrical Engineering, Microelectronics, Materials Science, Physics, or any related STEM degree with 5 years relevant experience (Masters with 3 years exp or PhD with 1 years exp).
• Must have an understanding of semiconductor processing and fabrication.
• Must have an aptitude for hands-on laboratory and experimental work.
• Excellent verbal and written communication skills are required.
• Must be able to obtain and maintain a Secret security clearance.
• US Citizenship required.

Nice To Haves

• Course work or hands on experience in semiconductor processing, analog and RF/mmW electronic circuits.
• III-V microelectronics fabrication experience.
• Device physics expertise in III-V electronics.
• Experience with circuit and electromagnetic modeling (SPICE, ADS, HFSS) and layout.
• DC and RF test analysis and compound semiconductor engineering experience.
• Experience with semiconductor device physics and transistor design.
• Prior experience operating and evaluating data from semiconductor metrology tools.
• Experience with DOEs, JMP, and statistical analysis.

Responsibilities

• Lead device and process development efforts in bringing development programs into production.
• Engage in development work where no precedent may exist.
• Interface with test and design engineers to ensure high-quality, comprehensive efforts are integral components of successful programs.
• Work hands-on in laboratory and semiconductor fabrication environments.
• Handle multiple, novel material systems and projects.

Benefits

• Health insurance coverage
• Life and disability insurance
• Savings plan
• Company paid holidays
• Paid time off (PTO) for vacation and/or personal business

What This Job Offers

• Job Type: Full-time
• Career Level: Mid Level
• Industry: Transportation Equipment Manufacturing
• Education Level: Bachelor's degree