Principal R&D Thermal Product Development Engineer

TE Connectivity • Middletown, PA

63d • $154,100 - $192,600

About The Position

TE Connectivity’s R&D/Product Development Engineering Teams are responsible for driving new products from concept to high-volume manufacturing. From market definition through production and release, the team conducts feasibility studies, performs/directs/supports detailed design, prototyping, testing, and manufacturing ramp of new and modified designs, defines material requirements and new or improved manufacturing processes, and assists in the qualification of suppliers for new products. The Thermal Development Group within the Advanced Development Team has responsibility for finding innovative solutions to thermal challenges in the high-speed interconnect industry, including thermal design and evaluation of associated products. Through modeling and physical validation, those solutions are enabled by the larger TE manufacturing base to be brought to the global market.

Requirements

• Bachelor’s Degree in related field required; Masters or PhD preferred.
• 10+ years of engineering experience, including 6+ years in the electronics cooling industry.
• 10+ years of thermal modeling with ANSYS Icepak, Fluent, and/or similar CFD tool.
• 3D CAD skills with PTC Creo (ProE) or ANSYS SpaceClaim.
• Experience with and knowledge of liquid and/or immersion cooling.
• Experience with mechanical structural analysis is a plus.
• Self-motivated, efficient, able to work with little or no supervision, and committed to a team approach.
• Strong interpersonal, organization, and project management skills.
• Ability to prioritize responsibilities in a fast-paced work environment.
• Experience in and knowledge of the high-speed digital industry is a plus.
• Experience in core processes such as stamping, molding, plating, and assembly preferred.
• Familiarity with standards related to data center cooling (e.g, ASHRAE).
• Track record of innovation (patents, publications, etc.)

Nice To Haves

• Experience with mechanical structural analysis.
• Experience in and knowledge of the high-speed digital industry.
• Experience in core processes such as stamping, molding, plating, and assembly.
• Familiarity with standards related to data center cooling (e.g, ASHRAE).

Responsibilities

• Develop innovative cooling solutions for the high-speed digital interconnect industry.
• Research and apply emerging technologies to new product development.
• Analyze electronics cooling problems through robust modeling methods.
• Address near-adjacent technical challenges such as manufacturability, tolerancing, structural integrity, life cycle, cost & market acceptance.
• Help expand global Best Known Methods related to simulation.
• Present data and ideas in a clear and impactful manner.
• Interface with engineering teams of various disciplines, including external customers.

Benefits

• A comprehensive benefits package including health insurance, 401(k), disability, life insurance, employee stock purchase plan, paid time off and voluntary benefits.

What This Job Offers

• Job Type: Full-time
• Career Level: Senior
• Education Level: Master's degree
• Number of Employees: 5,001-10,000 employees